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FFPF10U60DN Dataheets PDF



Part Number FFPF10U60DN
Manufacturers Fairchild Semiconductor
Logo Fairchild Semiconductor
Description ULTRA FAST RECOVERY POWER RECTIFIER
Datasheet FFPF10U60DN DatasheetFFPF10U60DN Datasheet (PDF)

FFPF10U60DN FFPF10U60DN Features • High voltage and high reliability • High speed switching • Low forward voltage Applications • • • • General purpose Switching mode power supply Free-wheeling diode for motor application Power switching circuits TO-220F 1 2 3 1. Anode 2.Cathode 3. Anode ULTRA FAST RECOVERY POWER RECTIFIER Absolute Maximum Ratings Symbol VRRM IF(AV) IFSM TJ, TSTG (per diode) TC=25°C unless otherwise noted Value 600 @ TC = 100°C 10 60 - 65 to +150 Units V A A °C Parameter Peak.

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FFPF10U60DN FFPF10U60DN Features • High voltage and high reliability • High speed switching • Low forward voltage Applications • • • • General purpose Switching mode power supply Free-wheeling diode for motor application Power switching circuits TO-220F 1 2 3 1. Anode 2.Cathode 3. Anode ULTRA FAST RECOVERY POWER RECTIFIER Absolute Maximum Ratings Symbol VRRM IF(AV) IFSM TJ, TSTG (per diode) TC=25°C unless otherwise noted Value 600 @ TC = 100°C 10 60 - 65 to +150 Units V A A °C Parameter Peak Repetitive Reverse Voltage Average Rectified Forward Current Non-repetitive Peak Surge Current 60Hz Single Half-Sine Wave Operating Junction and Storage Temperature Thermal Characteristics Symbol RθJC Parameter Maximum Thermal Resistance, Junction to Case (per diode) T C =25 °C unless otherwise noted Min. Typ. Max. Units V Value 2.5 Units °C/W Electrical Characteristics Symbol V FM * Parameter Maximum Instantaneous Forward Voltage I F = 10A I F = 10A TC = 25 °C TC = 100 °C TC = 25 °C TC = 100 °C 2.2 2.0 µA 5 50 90 6 270 1.0 ns A nC mJ IRM * Maximum Instantaneous Reverse Current @ rated VR Maximum Reverse Recovery Time Maximum Reverse Recovery Current Maximum Reverse Recovery Charge (IF =10A, di/dt = 200A/ µs) trr Irr Qrr WAVL Avalanche Energy * Pulse Test: Pulse Width=300µs, Duty Cycle=2% ©2000 Fairchild Semiconductor International Rev. F, September 2000 FFPF10U60DN Typical Characteristics 20 10 1000 Forward Current , IF [A] [µA] 100 R TC = 100 C TC = 25 C 1 o o TC = 100 C 10 o Reverse Current , I 1 TC = 25 C 0.1 o 0.01 0.1 0.0 1E-3 0.5 1.0 1.5 2.0 2.5 3.0 100 200 300 400 500 600 Forward Voltage , VF [V] Reverse Voltage , VR [V] Figure 1. Typical Forward Voltage Drop vs. Forward Current 100 Figure 2. Typical Reverse Current vs. Reverse Voltage 100 Reverse Recovery Time , trr [ns] Typical Capacitance at 0V = 80 pF 90 IF = 10A o TC = 25 C Capacitance , Cj [pF] 75 80 50 70 60 25 50 1 0.1 1 10 100 40 100 500 Reverse Voltage , VR [V] di/dt [A/µs] Figure 3. Typical Junction Capacitance Figure 4. Typical Reverse Recovery Time vs. di/dt 16 14 12 10 Reverse Recovery Current , Irr [A] 7 6 5 4 3 2 1 0 100 500 Average Forward Current , I 8 T C = 25 C o F(AV) 9 IF = 10A [A] 10 C D 8 6 4 2 0 60 80 100 120 o 140 160 di/dt [A/µs] Case Temperature , TC [ C] Figure 5. Typical Reverse Recovery Current vs. di/dt ©2000 Fairchild Semiconductor International Figure 6. Forward Current Derating Curve Rev. F, September 2000 FFPF10U60DN Package Dimensions TO-220F 3.30 ±0.10 10.16 ±0.20 (7.00) ø3.18 ±0.10 2.54 ±0.20 (0.70) 6.68 ±0.20 15.80 ±0.20 (1.00x45°) MAX1.47 9.75 ±0.30 0.80 ±0.10 (3 ) 0° 0.35 ±0.10 2.54TYP [2.54 ±0.20] #1 0.50 –0.05 2.54TYP [2.54 ±0.20] 4.70 ±0.20 +0.10 2.76 ±0.20 9.40 ±0.20 Dimensions in Millimeters Rev. F, September 2000 ©2000 Fairchild Semiconductor International 15.87 ±0.20 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx™ Bottomless™ CoolFET™ CROSSVOLT™ DOME™ E2CMOSTM EnSignaTM FACT™ FACT Quiet Series™ FAST® DISCLAIMER FASTr™ GlobalOptoisolator™ GTO™ HiSeC™ ISOPLANAR™ MICROWIRE™ OPTOLOGIC™ OPTOPLANAR™ POP™ PowerTrench® QFET™ QS™ QT Optoelectronics™ Quiet Series™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SyncFET™ TinyLogic™ UHC™ VCX™ FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at.


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