Fast recovery type
Chip Silicon Rectifier
FFM301 THRU FFM307
Fast recovery type
Formosa MS
SMC
0.276(7.0) 0.260(6.6) 0.012(0.3) Typ.
Fea...
Description
Chip Silicon Rectifier
FFM301 THRU FFM307
Fast recovery type
Formosa MS
SMC
0.276(7.0) 0.260(6.6) 0.012(0.3) Typ.
Features
Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current.
0.032(0.8) Typ. 0.040(1.0) Typ. 0.152(3.8) 0.144(3.6)
0.189(4.8) 0.173(4.4)
0.244(6.2) 0.228(5.8)
0.087(2.2) 0.071(1.8)
Mechanical data
Case : Molded plastic, JEDEC DO-214AB Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 Polarity : Indicated by c athode band Mounting P osition : Any Weight : 0.00585 ounce, 0.195 gram
0.040 (1.0) Typ.
Dimensions in inches and (millimeters)
MAXIMUM RATINGS (AT TA=25oC unless otherwise noted)
PARAMETER Forward rectified current Forward surge current CONDITIONS Ambient temperature = 55 C 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) VR = VRRM TA = 25o C
o
Symbol IO IFSM
MIN.
TYP.
MAX. 3.0 100 10.0 300
UNIT A A uA uA
o
Reverse current Thermal resistance Diode junction capacitance Storage temperature
VR = VRRM TA = 100o C Junction to ambient f=1MHz and applied 4vDC reverse voltage
IR Rq JA CJ TSTG -55 50 60
C / w pF
+150
o
C
SYMBOLS
MARKING CODE F31 F32 F33 F34 F35 F36 F37
V RRM
(V)
*1
V RMS
(V) 35 70 140 280 420 560 700
*2
VR
*3
VF
*4
T RR
*5
Operating temperature ( o C)
(V) 50 100 200 400 600 800 1000
(V)
(nS)
FF...
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