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D10 Dataheets PDF



Part Number D10
Manufacturers STMicroelectronics
Logo STMicroelectronics
Description Memory Micromodules
Datasheet D10 DatasheetD10 Datasheet (PDF)

D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging s Micromodules were developed specifically for embedding in Smartcards and Memory Cards The Micromodule provides: – Support for the chip – Electrical contacts – Suitable embedding interface for gluing the module to the plastic package potting side contact side s D15 s Physical dimensions and contact positions compliant to the ISO 7816 standard Micromodules delivered as a continuous.

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D10, D15, D20, D22, C20, C30 MICROMODULES Memory Micromodules General Information for D1, D2 and C Packaging s Micromodules were developed specifically for embedding in Smartcards and Memory Cards The Micromodule provides: – Support for the chip – Electrical contacts – Suitable embedding interface for gluing the module to the plastic package potting side contact side s D15 s Physical dimensions and contact positions compliant to the ISO 7816 standard Micromodules delivered as a continuous Super 35 mm tape. (This differs from the standard 35 mm tape in the spacing distance between the indexing holes.) D10 D20 1 1 1 1 s 1 1 1 1 DESCRIPTION Memory Cards consist of two main parts: the plastic card, and the embedded Micromodule (which, in turn, carries the silicon chip). The plastic card is made of PVC, ABS or similar material, and can be over-printed with graphics, text, and magnetic strips. The Micromodule is embedded in a cavity in the plastic card. The Micromodules are mounted on Super 35 mm metallized epoxy tape, and are delivered on reels. These contain all of the chips from a number of wafers, including those chips that were found to be non-functioning during testing. Traceability is ensured by a label fixed on the reel. D22 C30 C20 Table 1. Memory Card and Memory Tag Integrated Circuits Modul e D10 D15 D20 D22 C30 C20 Please see the data briefing sheets of these products for example illustrations of these micromodules ST1200, ST1305B, ST1331, ST1333, ST1335, ST1336, ST1353, ST1355 ST14C02, ST1305B, ST1335, ST1336, ST1355 ST14C02, M14C04, M14C16, M14C32 M14C64, M14128, M14256 M35101, M35102 M35101, M35102 December 1999 1/13 MICROMODULES Table 2. Memory Card Products Type ST14C02C M14C04 M14C16 M14C32 M14C64 M14128 M14256 ST1200 ST1305B ST1331 ST1333 ST1335 ST1336 M35101 M35102 Contactless Memory Chip, 13.56 MHz, 2048 bit EEPROM Contactless Memory Chip with 64-bit Unique ID, 13.56 MHz, 2048 bit EEPROM Memory Card IC, 272 bit High Endurance EEPROM with Advanced Security Mechanisms Description (please see the individual product data sheets for full specifications) Memory Card IC, 2 Kbit (256 x 8) Serial I2C Bus EEPROM Memory Card IC, 4 Kbit Serial I2C Bus EEPROM Memory Card IC, 16 Kbit Serial I2C Bus EEPROM Memory Card IC, 32 Kbit Serial I2C Bus EEPROM Memory Card IC, 64 Kbit Serial I2C Bus EEPROM Memory Card IC, 128 Kbit Serial I 2C Bus EEPROM Memory Card IC, 256 Kbit Serial I 2C Bus EEPROM Memory Card IC, 256 bit OTP EPROM with Lock-Out Memory Card IC, 192 bit High Endurance EEPROM with Secure Logic Access Control Process 1.2 µm 0.6 µm 0.6 µm 0.6 µm 0.6 µm 0.6 µm 0.6 µm 3.5 µm 1.5 µm 1.2 µm 1.2 µm 1.2 µm 1.2 µm 0.6 µm 0.6 µm Technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS NMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS Module Style D15, D20 D20 D20 D20 D22 D22 D22 D10 D10, D15 D10 D10 D10, D15 D10, D15 C20, C30 C20, C30 The assembly flows is as follows: 1. Dice sawing 2. Dice attach 3. Wire bonding 4. Potting 5. Milling (depending on product) The range of products and types of Micromodule are summarized in Table 1 and Table 2. For large volumes, ST is able to offer customized module tape. DELIVERY The Super 35mm metallized epoxy tape is delivered on reels, as shown in Figure 1. These contain all of the chips from a number of wafers, including those chips that were found to be nonfunctioning during testing. Traceability is ensured by a label fixed on the reel. The typical quantity is 10,000 modules per reel, with priority given to lot integrity on the reel. The maximum quantity is 15,000 per reel. Parts which are faulty (mechanically or electrically defective) are identified by punch holes. The specification for the reject punch holes is shown in Figure 4 for the D10 micromodule, in Figure 5 for the D15 micromodule, in Figure 6 for the D20 micromodule, and in Figure 7 for the D22 micromodule. Tape joins (tape splicing) are never more than 10 per 10 metre length, as shown in Figure 2 and Figure 3. At least 2.1 m of leader, and 2.1 m of trailer is included on each reel. Each is made of PVC Super 35 mm tape, without metalisation, and is opaque to infrared and white light. A “failure” marking of reject holes is included at the beginning and end of the tape of a minimum of 5 consecutive module pitches (double positions). Modules should be stored within the temperature range -40 °C to + 85 °C, for no more than 1 year. Each reel is packed in an antistatic bag, along with a desiccant bag, and a humidity indicator card. This card indicates the level of humidity as follows: 30 - Blue: protection assured 40 - Pink: renew the desiccant bag 50 - Pink: protection no longer ensured Three self adhesive plastic identification labels are attached: one to the reel, one to the antistatic bag, 2/13 MICROMODULES Table 3. Manufacturing Flow and Manufacturing Facility Locations Operation Rousset, France. 6” wafer fab. Wafer Diffusion Agrate, Italy. 6” wafer fab.: standard EEPROM only Rousset, France. Electrical W.


CZTUX87 D10 D1001UK


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