HT1MOA3S30

HT1 MOA3 S30 HITAG 1 Chip Module Preliminary Specification Revision 1.1 August 1997 TM Specifications of the HT1 MOA3 S30 Rev. 1.1 1997-08-19 Table of Contents 1 Definitions .............................................................................................................................. 3 1.1 Objective of the Specifications ..................................................................................................................... 3 1.2 Definition of the Chip Module ..................................................................................................................... 3 1.3 Use of the Modules ...................................................................................................................................... 3 2 Specifications ......................................................................................................................... 4 2.1 Mechanical Properties ................................................................................................................................. 4 2.2 Materials ..................................................................................................................................................... 4 2.3 Temperature Range ..................................................................................................................................... 4 2.4 Storage Conditions ..............................................................................