16M x 4-Bit Dynamic RAM
16M x 4-Bit Dynamic RAM (4k & 8k Refresh)
HYB 3164400J/T -50/-60 HYB 3165400J/T -50/-60
Preliminary Information
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Description
16M x 4-Bit Dynamic RAM (4k & 8k Refresh)
HYB 3164400J/T -50/-60 HYB 3165400J/T -50/-60
Preliminary Information
16 777 216 words by 4-bit organization 0 to 70 ˚C operating temperature Fast access and cycle time RAS access time: 50 ns (-50 version) 60 ns (-60 version) Cycle time: 90 ns (-50 version) 110 ns (-60 version) CAS access time: 13 ns ( -50 version) 15 ns ( -60 version) Fast page mode cycle time 35 ns (-50 version) 40 ns (-60 version) Single + 3.3 V (± 0.3V) power supply Low power dissipation max. 396 active mW ( HYB 3164400J/T-50) max. 360 active mW ( HYB 3164400J/T-60) max. 504 active mW ( HYB 3165400J/T-50) max. 432 active mW ( HYB 3165400J/T-60) 7.2 mW standby (TTL) 720 W standby (MOS) Read, write, read-modify-write, CAS-before-RAS refresh (CBR), RAS-only refresh, hidden refresh and self refresh modes Fast page mode capability 8192 refresh cycles/128 ms , 13 R/ 11C addresses (HYB 3164400J/T) 4096 refresh cycles/ 64 ms , 12 R/ 12C addresses (HYB 3165400J/T) Plastic Package: P-SOJ-34-1 500 mil HYB 3164(5)400J P-TSOPII-34-1 500 mil HYB 3164(5)400T
Semiconductor Group
61
HYB 3164(5)400J/T-50/-60 16M x 4-DRAM
This device is a 64 MBit dynamic RAM organized 16 777 216 by 4 bits. The device is fabricated in SIEMENS/IBM most advanced first generation 64Mbit CMOS silicon gate process technology. The circuit and process design allow this device to achieve high performance and low power dissipation. This DRAM operates with a single 3.3 +/-0.3V p...
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