8Gb (32M x 8Bank x 32) Double DATA RATE 3 Stack SDRAM
Revision History
Revision 0.1 (May. 2012) -First release.
Revision 0.2 (Feb. 2013) -Update ZQ pins description.
Revision...
Description
Revision History
Revision 0.1 (May. 2012) -First release.
Revision 0.2 (Feb. 2013) -Update ZQ pins description.
Revision 0.3 (Apr. 2014) -Update tFAW.
EM47EM3288SBA
Apr. 2014
1/39
www.eorex.com
EM47EM3288SBA
8Gb (32M×8Bank×32) Double DATA RATE 3 Stack SDRAM
Features
JEDEC Standard VDD/VDDQ = 1.5V±0.075V. All inputs and outputs are compatible with SSTL_15
interface. Fully differential clock inputs (CK, /CK) operation. Eight Banks Posted CAS by programmable additive latency Bust length: 4 with Burst Chop (BC) and 8. CAS Write Latency (CWL): 5,6,7,8 CAS Latency (CL): 5,6,7,8,9,10 Write Latency (WL) =Read Latency (RL) -1. Bi-directional Differential Data Strobe (DQS). Data inputs on DQS centers when write. Data outputs on DQS, /DQS edges when read. On chip DLL align DQ, DQS and /DQS transition
with CK transition. DM mask write data-in at the both rising and falling
edges of the data strobe. Sequential & Interleaved Burst ...
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