MM3608

MITSUMI 300mA LDO with thermal shutdown MM3608 Series 300mA LDO with thermal shutdown Monolithic IC MM3608 Series SOT-25A 1. Flat-TV 2. BD Player/ Recorders 3. PCs 4. Games MITSUMI 300mA LDO with thermal shutdown MM3608 Series MITSUMI 300mA LDO with thermal shutdown MM3608 Series MITSUMI 300mA LDO with thermal shutdown MM3608 Series MITSUMI 300mA LDO with thermal shutdown MM3608 Series MITSUMI 300mA LDO with thermal shutdown MM3608 Series MITSUMI 300mA LDO with thermal shutdown MM3608 Series About Power Dissipation The Power dissipation change if board to mount IC change because radiative heat fix at board.It is reference data below, Evaluate IC in the set. 1. JEDEC51-7 standard Board size 114.3mm×76.2mm t=1.6mm Copper foil area 80% Power dissipation 560mW Ta=25°C (It is reference value measured by JEDEC51-7 standard.) 2. Spec. sheet condition Board size 60mm×40mm t=1.6mm Copper foil area 60% Power dissipation 280mW Ta=25°C Condition of temperature and input voltage, output current should be used in enough margin concerning power dissipation. In consideration of product life, recommend to use in less than 80%. It is recommended to layout the VIA for heat radiation in the GND pattern of reverse (of IC) when there is the GND pattern in the inner layer (in using multiplayer substrate). By increasing these copper foil pattern area of PCB, Power dissipation improves. MITSUMI 300mA LDO with thermal shutdown MM3608 Series MITSUMI 300mA LDO with thermal sh...