HMPP-389T

HMPP-389x Series MiniPak Surface Mount RF PIN Switch Diodes Data Sheet Description/Applications These ultra-miniature products represent the blending of Avago Technologies’ proven semiconductor and the latest in leadless packaging technology. Features Surface mount MiniPak package – low height, 0.7 mm (0.028") max. – small footprint, 1.75 mm2 (0.0028 inch2) The HMPP-389x series is optimized for switching applications where low resistance at low current and low capacitance are required. The MiniPak package offers reduced parasitics when compared to conventional leaded diodes, and lower thermal resistance. Better thermal conductivity for higher power dissipation Single and dual versions Matched diodes for consistent performance Low capacitance Low junction capacitance of the PIN diode chip, combined with ultra low package parasitics, mean that these products may be used at frequencies which are higher than the upper limit for conventional PIN diodes. Note ...