Document
BZX55C Series
MECHANICAL DATA Dimensions in mm(inches)
0.51 ± 0.10 (0.02 ± 0.004)
3
0.31 (0.012)
rad.
2.54 ± 0.13 (0.10 ± 0.005) 0.76 ± 0.15 (0.03 ± 0.006)
21
1.91 ± 0.10 (0.075 ± 0.004)
3.05 ± 0.13 (0.12 ± 0.005)
0.31 (0.012)
rad.
A = 1.02 ± 0.10 (0.04 ± 0.004)
A
1.40 (0.055)
max.
LCC1 PACKAGE
Underside View
Pad 1 – Anode
Pad 2 – N/C
Pad 3 – Cathode
VOLTAGE REGULATOR DIODE IN A
CERAMIC SURFACE MOUNT PACKAGE
FOR HI–REL APPLICATIONS
FEATURES
• HERMETIC CERAMIC SURFACE MOUNT PACKAGE (SOT23 COMPATIBLE)
• VOLTAGE RANGE 2.4 TO 75V
ABSOLUTE MAXIMUM RATINGS
PTOT
Power Dissipation
Derate above 25°C
TMB = 25°C
TOP TSTG TSOL RθJA RθJ–MB
Maximum Operating Ambient Temperature
Storage Temperature Range
Soldering Temperature
(5 seconds max.)
Thermal Resistance Junction to Ambient
Thermal Resistance Junction to Mounting Base
500mW 4mW/°C –55 to +150°C –65 to +175°C 260°C 336°C/W 140°C/W
ELECTRICAL CHARACTERISTICS (TA = 25°C unless.