EDB8164B3PF

DATA SHEET 8G bits DDR2 Mobile RAM™ PoP (12mm × 12mm, 216-ball FBGA) EDB8164B3PF Specifications Density: 8G bits Organization — 2 pieces of 4Gb (16M words × 32 bits × 8 banks) in one package — Independent 2-channel bus Data rate: 1066Mbps (max.) Package: 216-ball FBGA — Package size: 12.0mm × 12.0mm — Ball pitch: 0.4mm — Lead-free (RoHS compliant) and Halogen-free Power supply — VDD1 = 1.70V to 1.95V — VDD2, VDDQ = 1.14V to 1.30V Interface: HSUL_12 Operating case temperature range — TC = -30°C to +85°C Features JEDEC LPDDR2-S4B compliance DLL is not implemented Low power consumption Mobile RAM functions — Partial Array Self-Refresh (PASR) — Auto Temperature Compensated Self-Refresh (ATCSR) by built-in temperature sensor — Deep power-down mode — Per Bank Refresh This FBGA is suitable for Package on Package (PoP) Block Diagram VDD1 VDD2 VDDQ VREFCA_a, VREFCA_b VREFDQ_a, VREFDQ_b VSS CK_a, /CK_a CA0_a to...