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BUZ341

Siemens Semiconductor Group

Power Transistor

BUZ 341 SIPMOS ® Power Transistor • N channel • Enhancement mode • Avalanche-rated Pin 1 G Pin 2 D Pin 3 S Type BU...


Siemens Semiconductor Group

BUZ341

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BUZ 341 SIPMOS ® Power Transistor N channel Enhancement mode Avalanche-rated Pin 1 G Pin 2 D Pin 3 S Type BUZ 341 VDS 200 V ID 33 A RDS(on) 0.07 Ω Package TO-218 AA Ordering Code C67078-S3128-A2 Maximum Ratings Parameter Continuous drain current Symbol Values 33 Unit A ID IDpuls 132 TC = 28 °C Pulsed drain current TC = 25 °C Avalanche current,limited by Tjmax Avalanche energy,periodic limited by Tjmax Avalanche energy, single pulse IAR EAR EAS 33 16 mJ ID = 33 A, VDD = 50 V, RGS = 25 Ω L = 1.09 mH, Tj = 25 °C Gate source voltage Power dissipation 790 VGS Ptot ± 20 170 V W TC = 25 °C Operating temperature Storage temperature Thermal resistance, chip case Thermal resistance, chip to ambient DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Semiconductor Group Tj Tstg RthJC RthJA -55 ... + 150 -55 ... + 150 ≤ 0.74 75 E 55 / 150 / 56 °C K/W 1 07/96 BUZ 341 Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit V(BR)DSS 200 3 0.1 10 10 0.06 4 V VGS = 0 V, ID = 0.25 mA, Tj = 25 °C Gate threshold voltage VGS(th) 2.1 VGS=VDS, ID = 1 mA Zero gate voltage drain current IDSS 1 100 µA VDS = 200 V, VGS = 0 V, Tj = 25 °C VDS = 200 V, VGS = 0 V, Tj = 125 °C Gate-source leakage current IGSS 100 nA Ω 0.07 VGS = 20 V, VDS = 0 V Drain-Source on-resistance RDS(on) VGS = 10 V, ID = 21 A Semiconductor Group 2 07/96 ...




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