BUZ 341
SIPMOS ® Power Transistor
• N channel • Enhancement mode • Avalanche-rated
Pin 1 G
Pin 2 D
Pin 3 S
Type BU...
BUZ 341
SIPMOS ® Power
Transistor
N channel Enhancement mode Avalanche-rated
Pin 1 G
Pin 2 D
Pin 3 S
Type BUZ 341
VDS
200 V
ID
33 A
RDS(on)
0.07 Ω
Package TO-218 AA
Ordering Code C67078-S3128-A2
Maximum Ratings Parameter Continuous drain current Symbol Values 33 Unit A
ID IDpuls
132
TC = 28 °C
Pulsed drain current
TC = 25 °C
Avalanche current,limited by Tjmax Avalanche energy,periodic limited by Tjmax Avalanche energy, single pulse
IAR EAR EAS
33 16 mJ
ID = 33 A, VDD = 50 V, RGS = 25 Ω L = 1.09 mH, Tj = 25 °C
Gate source voltage Power dissipation 790
VGS Ptot
± 20 170
V W
TC = 25 °C
Operating temperature Storage temperature Thermal resistance, chip case Thermal resistance, chip to ambient DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1
Semiconductor Group
Tj Tstg RthJC RthJA
-55 ... + 150 -55 ... + 150 ≤ 0.74 75 E 55 / 150 / 56
°C K/W
1
07/96
BUZ 341
Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit
V(BR)DSS
200 3 0.1 10 10 0.06 4
V
VGS = 0 V, ID = 0.25 mA, Tj = 25 °C
Gate threshold voltage
VGS(th)
2.1
VGS=VDS, ID = 1 mA
Zero gate voltage drain current
IDSS
1 100
µA
VDS = 200 V, VGS = 0 V, Tj = 25 °C VDS = 200 V, VGS = 0 V, Tj = 125 °C
Gate-source leakage current
IGSS
100
nA Ω 0.07
VGS = 20 V, VDS = 0 V
Drain-Source on-resistance
RDS(on)
VGS = 10 V, ID = 21 A
Semiconductor Group
2
07/96
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