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BUP403 Dataheets PDF



Part Number BUP403
Manufacturers Siemens Semiconductor Group
Logo Siemens Semiconductor Group
Description IGBT
Datasheet BUP403 DatasheetBUP403 Datasheet (PDF)

BUP 403 IGBT Preliminary data • Low forward voltage drop • High switching speed • Low tail current • Latch-up free • Avalanche rated Pin 1 G Type BUP 403 Maximum Ratings Parameter Collector-emitter voltage Collector-gate voltage Symbol Values 600 600 Unit V Pin 2 C Ordering Code C67078-A4406-A2 Pin 3 E VCE 600V IC 42A Package TO-220 AB VCE VCGR VGE IC RGE = 20 kΩ Gate-emitter voltage DC collector current, (limited by bond wire) ± 20 A 42 32 TC = 60 °C TC = 90 °C Pulsed collector current,.

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BUP 403 IGBT Preliminary data • Low forward voltage drop • High switching speed • Low tail current • Latch-up free • Avalanche rated Pin 1 G Type BUP 403 Maximum Ratings Parameter Collector-emitter voltage Collector-gate voltage Symbol Values 600 600 Unit V Pin 2 C Ordering Code C67078-A4406-A2 Pin 3 E VCE 600V IC 42A Package TO-220 AB VCE VCGR VGE IC RGE = 20 kΩ Gate-emitter voltage DC collector current, (limited by bond wire) ± 20 A 42 32 TC = 60 °C TC = 90 °C Pulsed collector current, tp = 1 ms ICpuls 104 64 TC = 25 °C TC = 90 °C Avalanche energy, single pulse EAS 65 mJ IC = 25 A, VCC = 50 V, RGE = 25 Ω L = 200 µH, Tj = 25 °C Power dissipation Ptot 200 W - 55 ... + 150 - 55 ... + 150 °C TC = 25 °C Chip or operating temperature Storage temperature Tj Tstg Semiconductor Group 1 Jul-31-1996 BUP 403 Maximum Ratings Parameter DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Thermal Resistance Thermal resistance, chip case Symbol Values E 55 / 150 / 56 Unit - RthJC ≤ 0.63 K/W Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol min. Static Characteristics Gate threshold voltage Values typ. max. Unit VGE(th) 4.5 5.5 2.1 2.2 3 3.3 6.5 2.7 2.8 - V VGE = VCE, IC = 0.7 mA Collector-emitter saturation voltage VCE(sat) - VGE = 15 V, IC = 30 A, Tj = 25 °C VGE = 15 V, IC = 30 A, Tj = 125 °C VGE = 15 V, IC = 60 A, Tj = 25 °C VGE = 15 V, IC = 60 A, Tj = 125 °C Zero gate voltage collector current ICES 150 µA nA 100 VCE = 600 V, VGE = 0 V, Tj = 25 °C Gate-emitter leakage current IGES VGE = 25 V, VCE = 0 V AC Characteristics Transconductance gfs 6 1600 170 100 - S pF 2150 260 150 VCE = 20 V, IC = 30 A Input capacitance Ciss Coss - VCE = 25 V, VGE = 0 V, f = 1 MHz Output capacitance VCE = 25 V, VGE = 0 V, f = 1 MHz Reverse transfer capacitance Crss - VCE = 25 V, VGE = 0 V, f = 1 MHz Semiconductor Group 2 Jul-31-1996 BUP 403 Electrical Characteristics, at Tj = 25 °C, unless otherwise specified Parameter Symbol min. Switching Characteristics, Inductive Load at Tj = 125 °C Turn-on delay time td(on) Values typ. max. Unit ns 50 75 VCC = 300 V, VGE = 15 V, IC = 30 A RGon = 33 Ω Rise time - tr 80 120 VCC = 300 V, VGE = 15 V, IC = 30 A RGon = 33 Ω Turn-off delay time td(off) 250 340 VCC = 300 V, VGE = -15 V, IC = 30 A RGoff = 33 Ω Fall time tf 500 700 VCC = 300 V, VGE = -15 V, IC = 30 A RGoff = 33 Ω Semiconductor Group 3 Jul-31-1996 BUP 403 Power dissipation Ptot = ƒ(TC) parameter: Tj ≤ 150 °C 220 W Collector current IC = ƒ(TC) parameter: VGE ≥ 15 V , Tj ≤ 150 °C 55 A Ptot 180 160 140 120 100 80 60 40 20 0 0 20 40 60 80 100 120 °C 160 IC 45 40 35 30 25 20 15 10 5 0 0 20 40 60 80 100 120 °C 160 TC TC Safe operating area IC = ƒ(VCE) parameter: D = 0, TC = 25°C , Tj ≤ 150 °C 10 3 Transient thermal impedance Zth JC = ƒ(tp) parameter: D = tp / T 10 0 IGBT A K/W IC 10 2 t = 12.0µs p ZthJC 10 -1 100 µs 10 1 D = 0.50 0.20 1 ms 10 -2 0.10 0.05 10 0 10 ms single pulse DC 10 -1 0 10 10 -3 -5 10 0.02 0.01 10 1 10 2 V 10 3 10 -4 10 -3 10 -2 10 -1 s 10 0 VCE tp Semiconductor Group 4 Jul-31-1996 BUP 403 Typ. output characteristics Typ. output characteristics IC = f (VCE) parameter: tp = 80 µs, Tj = 25 °C 60 A 50 17V 15V 13V 11V 9V 7V IC = f (VCE) parameter: tp = 80 µs, Tj = 125 °C 60 A 50 17V 15V 13V 11V 9V 7V IC 45 40 35 30 25 20 15 10 5 0 0 IC 45 40 35 30 25 20 15 10 5 1 2 3 V 5 0 0 1 2 3 V 5 VCE VCE Typ. transfer characteristics IC = f (VGE) parameter: tp = 80 µs, VCE = 20 V 60 A 50 IC 45 40 35 30 25 20 15 10 5 0 0 2 4 6 8 10 V 14 VGE Semiconductor Group 5 Jul-31-1996 BUP 403 Typ. switching time Typ. switching time I = f (IC) , inductive load , Tj = 125°C par.: VCE = 300 V, VGE = ± 15 V, RG = 33 Ω 10 3 t = f (RG) , inductive load , Tj = 125°C par.: VCE = 300 V, VGE = ± 15 V, IC = 30 A 10 3 tf t t ns tdoff tf tdoff ns tr 10 2 10 2 tr tdon tdon 10 1 0 10 20 30 40 50 60 A IC 80 10 1 0 20 40 60 80 Ω 120 RG Typ. switching losses Typ. switching losses E = f (IC) , inductive load , Tj = 125°C par.: VCE = 300 V, VGE = ± 15 V, RG = 33 Ω 10 mWs E 8 7 6 5 4 3 2 1 0 0 10 20 30 40 50 60 A IC 80 Eoff E = f (RG) , inductive load , Tj = 125°C par.: VCE = 300V, VGE = ± 15 V, IC = 30 A 5.0 mWs E 4.0 3.5 3.0 2.5 Eoff Eon Eon 2.0 1.5 1.0 0.5 0.0 0 20 40 60 80 Ω 120 RG Semiconductor Group 6 Jul-31-1996 BUP 403 Typ. gate charge VGE = ƒ(QGate) parameter: IC puls = 30 A 20 V Typ. capacitances C = f (VCE) parameter: VGE = 0 V, f = 1 MHz 10 1 nF VGE 16 14 12 10 8 C 100 V 300 V Ciss 10 0 Coss 10 -1 Crss 6 4 2 0 0 10 -2 0 20 40 60 80 100 nC 130 5 10 15 20 25 30 Q Gate V 40 VCE Short circuit safe operating area Reverse biased safe operating area ICsc = f (VCE) , Tj = 150°C parameter: VGE = ± 15 V, tsc ≤ 10 µs, L < 50 nH 10 ICpuls = f (VCE) , Tj = 150°C parameter: VGE = 15 V 2.5 I Csc/I C(90°C) I Cpuls/I C 6 1.5 4.


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