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MC78L05AB Dataheets PDF



Part Number MC78L05AB
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description Three-Terminal Low CurrentPositive Voltage Regulators
Datasheet MC78L05AB DatasheetMC78L05AB Datasheet (PDF)

MC78L00A Series, NCV78L00A 100 mA Positive Voltage Regulators The MC78L00A Series of positive voltage regulators are inexpensive, easy−to−use devices suitable for a multitude of applications that require a regulated supply of up to 100 mA. Like their higher powered MC7800 and MC78M00 Series cousins, these regulators feature internal current limiting and thermal shutdown making them remarkably rugged. No external components are required with the MC78L00 devices in many applications. These device.

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MC78L00A Series, NCV78L00A 100 mA Positive Voltage Regulators The MC78L00A Series of positive voltage regulators are inexpensive, easy−to−use devices suitable for a multitude of applications that require a regulated supply of up to 100 mA. Like their higher powered MC7800 and MC78M00 Series cousins, these regulators feature internal current limiting and thermal shutdown making them remarkably rugged. No external components are required with the MC78L00 devices in many applications. These devices offer a substantial performance advantage over the traditional zener diode−resistor combination, as output impedance and quiescent current are substantially reduced. Features  Wide Range of Available, Fixed Output Voltages  Low Cost  Internal Short Circuit Current Limiting  Internal Thermal Overload Protection  No External Components Required  Complementary Negative Regulators Offered (MC79L00A Series)  NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable  These are Pb−Free Devices 15k Q3 Q5 Q1 3.8k Q4 Q6 Input Q11 Q12 Q10 5.0k 3.0 Output 0-25k 1.2k Z1 Q2 420 1.9k 19k 2.2k C Q9 Q8 Q7 1.0k 2.85k Ground Figure 1. Representative Schematic Diagram http://onsemi.com 123 STRAIGHT LEAD BULK PACK TO−92 P SUFFIX CASE 029 1 2 3 BENT LEAD TAPE & REEL AMMO PACK Pin: 1. Output 2. Ground 3. Input SOIC−8* D SUFFIX CASE 751 *SOIC−8 is an internally modified SO−8 package. Pins 2, 3, 6, and 7 are electrically common to the die attach flag. This internal lead frame modification decreases package thermal resistance and increases power dissipation capability when appropriately mounted on a printed circuit board. SOIC−8 conforms to all external dimensions of the standard SO−8 package. PIN CONNECTIONS VOUT 1 GND 2 GND 3 NC 4 8 VIN 7 GND 6 GND 5 NC (Top View) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. DEVICE MARKING INFORMATION See general marking information in the device marking section on page 12 of this data sheet.  Semiconductor Components Industries, LLC, 2013 1 May, 2013 − Rev. 16 Publication Order Number: MC78L00A/D MC78L00A Series, NCV78L00A Input Cin* 0.33 mF MC78LXXA Output CO** 0.1 mF Figure 2. Standard Application A common ground is required between the input and the output voltages. The input voltage must remain typically 2.0 V above the output voltage even during the low point on the input ripple voltage. * Cin is required if regulator is located an appreciable distance from power supply filter. ** CO is not needed for stability; however, it does improve transient response. ABSOLUTE MAXIMUM RATINGS Rating Symbol Value Unit Input Voltage (5.0 V−9.0 V) Input Voltage (12 V−18 V) Input Voltage (24 V) VI 30 Vdc 35 40 Storage Temperature Range Maximum Junction Temperature Moisture Sensitivity Level Tstg −65 to +150 C TJ 150 C MSL 1 − ESD Capability, Human Body Model (Note 1) ESDHBM 2000 V ESD Capability, Machine Model (Note 1) ESDMM 200 V ESD Capability, Charged Device Model (Note 1) ESDCDM 2000 V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114) ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115) ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model. THERMAL CHARACTERISTICS Rating Symbol Value Unit Package Dissipation Thermal Characteristics, TO−92 Thermal Resistance, Junction−to−Ambient PD RqJA Internally Limited 200 W C/W Thermal Characteristics, SOIC8 Thermal Resistance, Junction−to−Ambient RqJA Refer to Figure 8 C/W 2. Thermal Resistance, Junction−to−Ambient depends on P.C.B. Copper area. See details in Figure 8. Thermal Resistance, Junction−to−Case is not defined. SOIC 8 lead and TO-92 packages that do not have a heat sink like other packages may have. This is the reason that a Theta JC is never specified. A little heat transfer will occur through the package but since it is plastic, it is minimal. The majority of the heat that is transferred is through the leads where they connect to the circuit board. http://onsemi.com 2 MC78L00A Series, NCV78L00A ELECTRICAL CHARACTERISTICS (VI = 10 V, IO = 40 mA, CI = 0.33 mF, CO = 0.1 mF, −40C < TJ < +125C (for MC78LXXAB, NCV78L05A), 0C < TJ < +125C (for MC78LXXAC), unless otherwise noted.) MC78L05AC, AB, NCV78L05A Characteristics Symbol Min Typ Max Unit Output Voltage (TJ = +25C) Line Regulat.


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