VS-FCSP0530ETR

www.vishay.com FlipKY® PRODUCT SUMMARY IF(AV) VR VF at IF IRM max. at 25 °C IRM max. at 125 °C TJ max. EAS VS-FCSP0530ETR Vishay Semiconductors FlipKY®, 0.5 A FEATURES Ultralow VF to footprint area Very low profile (< 0.6 mm) Low thermal resistance Supplied tested and on tape and reel Designed for consumer level APPLICATIONS Reverse polarity protection Current steering Freewheeling Flyback Oring 0.5 A 30 V 0.33 V 50 μA 15 mA 150 °C 5 mJ DESCRIPTION FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in the industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon rather than through protruding leads enabling designers to strategically place the diodes on the PCB. This design not only minimizes board space b...