MMSZ5221B

MMSZ5221B-MMSZ5260B Surface mount zener diode Features Planar die construction. 500mW power dissipation. General purpose, medium current. Ideally suited for automated assembly processes. RoHS compliant package Applications Zener diode. Ultra-small surface mount package. Packing & Order Information 3,000/Reel Graphic symbol MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS MAXIMUM RATING @ Ta=25°C unless otherwise specified Symbol Parameter Value VF Forward Voltage @ IF=10mA 0.9 PD RθJA Power Dissipation Thermal resistance,junction to ambient air 500 350 TJ Junction Temperature 150 Tstg Storage Temperature Range -65 to +150 Notes: 1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm2. 2. Tested with pulses, Tp ≤1.0ms. Unit V mW °C/W °C °C Publication Order Number: [MMSZ5221B-MMSZ5260B] © Bruckewell Technology Corporation Rev. A -2014 MMSZ5221B-MMSZ5260B Surface mount zener diode ELECTRICAL CHARACTERISTICS ...