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R5F21228KFP Dataheets PDF



Part Number R5F21228KFP
Manufacturers Renesas
Logo Renesas
Description MCU
Datasheet R5F21228KFP DatasheetR5F21228KFP Datasheet (PDF)

R8C/22 Group, R8C/23 Group RENESAS MCU REJ03B0097-0200 Rev.2.00 Aug 20, 2008 1. Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and suited to in-vehicle or FA network.

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R8C/22 Group, R8C/23 Group RENESAS MCU REJ03B0097-0200 Rev.2.00 Aug 20, 2008 1. Overview This MCU is built using the high-performance silicon gate CMOS process using the R8C CPU core and is packaged in a 48-pin plastic molded LQFP. This MCU operates using sophisticated instructions featuring a high level of instruction efficiency. With 1 Mbyte of address space, it is capable of executing instructions at high speed. This MCU is equipped with one CAN module and suited to in-vehicle or FA networking. Furthermore, the data flash (1 KB x 2 blocks) is embedded in the R8C/23 Group. The difference between R8C/22 and R8C/23 Groups is only the existence of the data flash. Their peripheral functions are the same. 1.1 Applications Automotive, etc. Rev.2.00 Aug 20, 2008 Page 1 of 48 REJ03B0097-0200 R8C/22 Group, R8C/23 Group 1. Overview 1.2 Performance Overview Table 1.1 outlines the Functions and Specifications for R8C/22 Group and Table 1.2 outlines the Functions and Specifications for R8C/.


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