H9TQ17ABJTMCUR-KUM

CI-MCP Specification 16GB eNAND (x8) + 16Gb LPDDR3 (x32) This document is a general product description and is subject to change without notice. SK hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 0.1 / Mar. 2014 1 Preliminary H9TQ17ABJTMCUR series 16GB eNAND (x8) / LPDDR3 16Gb(x32) Document Title CI-MCP 16GB eNAND(x8) Flash / 16Gb (x32) LPDDR3 Revision History Revision No. 0.1 - Initial Draft History Draft Date Mar. 2014 Remark Preliminary Rev 0.1 / Mar. 2014 2 Preliminary H9TQ17ABJTMCUR series 16GB eNAND (x8) / LPDDR3 16Gb(x32) FEATURES [ CI-MCP ] ● Operation Temperature - (-25)oC ~ 85oC ● Package - 221-ball FBGA - 11.5x13.0mm2, 1.0t, 0.5mm pitch - Lead & Halogen Free [ e-NAND ] [ LPDDR3 ] eMMC5.0 compatible (Backward compatible to eMMC4.5) Bus mode - Data bus width : 1 bit(default), 4 bits, 8 bits - Data transfer rate: up to 400MB/s (HS400) - MMC I/F Clock frequency : 0~200MHz - MMC I/F Boot frequency : 0~52MHz Operating voltage range - Vcc (NAND) : 2.7 - 3.6V - Vccq (Controller) : 1.7 - 1.95V / 2.7 - 3.6V Temperature - Operation (-25℃ ~ +85℃) - Storage without operation (-40℃ ~ +85℃) Others - This product is compliance with the RoHS directive     Supported features - HS400, HS200 - HPI, BKOPS - Packed CMD, Cache - Partitioning, RPMB - Discard, Trim, Erase, Sanitize - Write protect, Lock / Unlock - PON, Sleep / Awake - Reliable write - Boot feature, Boot partition - HW / SW Reset - Field ...