PPJX8872B
60V N-Channel Enhancement Mode MOSFET
Voltage
60 V
Current 200mA
Features
RDS(ON) , VGS@10V, ID@600mA<3Ω RDS(ON) ,
[email protected], ID@200mA<4Ω Advanced Trench Process Technology Specially Designed for Relay driver, Speed line drive, etc. Lead free in compliance with EU RoHS 2011/65/EU directive. Green molding compound as per IEC61249 Std. (Halogen Free)
SOT-563
Mechanical Data
Case: SOT-563 Package Terminals: Solderable per MIL-STD-750, Method 2026 Approx. Weight: 0.00009 ounces, 0.0026 grams Marking: X2B
Unit : inch(mm)
Maximum
Ratings
and
Thermal
Characteristics
o
(TA=25 C
unless
otherwise
noted)
PARAMETER
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current
Power Dissipation
TA=25oC Derate above 25oC
Operating Junction and Storage Temperature Range
Typical Thermal resistance - Junction to Ambient (Note 3)
SYMBOL VDS VGS ID IDM
PD
TJ,TSTG
RθJA
LIMIT 60 +30 200 800 300 4
-55~150
417
UNITS V V mA mA
mW mW/ oC
oC
oC/W
June 12,2015-REV.00
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PPJX8872B
Electrical
Characteristics
o
(TA=25 C
unless
otherwise
noted)
PARAMETER Static Drain-Source Breakdown Voltage Gate Threshold Voltage
Drain-Source On-State Resistance
Zero Gate Voltage Drain Current Gate-Source Leakage Current Dynamic (Note 4) Total Gate Charge Gate-Source Charge Gate-Drain Charge Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Drain-Source Diode Maximum Continuous Drain-Source Diode Forward Current
SYMBOL
BVDSS VGS(th)
RDS(on)
IDSS IGSS
Qg Qgs Qgd Ciss Coss Crss td(on) tr td(off) tf
IS
TEST CONDITION
VGS=0V,ID=250uA VDS=VGS, ID=250uA VGS=10V,ID=600mA VGS=4.5V,ID=200mA VDS=60V,VGS=0V VGS=+30V,VDS=0V
VDS=15V, ID=600mA, VGS=4.5V
VDS=25V, VGS=0V, f=1.0MHZ
VDD=10V, ID=600mA, VGS=10V, RG=6Ω (Note 1,2)
---
Diode Forward Voltage
VSD IS=500mA, VGS=0V
MIN. TYP. MAX. UNITS
60 -
-
1.0 1.8 2.5
- 1.3 3
- 1.7 4
V V
Ω
- - 1 uA - - +100 nA
- 0.82 - 0.53 - 0.22 - 34 - 11 - 3.0 - 2.7 - 21 - 3.8 - 18 -
nC pF ns
- - 500 mA - 0.9 1.5 V
NOTES: 1. Pulse width<300us, Duty cycle<2% 2. Essentially independent of operating temperature typical characteristics. 3. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. mounted on a 1 inch square pad of copper 4. Guaranteed by design, not subject to production testing
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PPJX8872B
TYPICAL CHARACTERISTIC CURVES
Fig.1 On-Region Characteristics
Fig.2 Transfer Characteristics
Fig.3 On-Resistance vs. Drain Current
Fig.4 On-Resistance vs. Junction temperature
Fig.5 On-Resistance Variation with VGS.
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Fig.6 Body Diode Characteristics
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PPJX8872B
TYPICAL CHARACTERISTIC CURVES
Fig.7 Gate-Charge Characteristics
Fig.8 Breakdown Voltage Variation vs. Temperature
Fig.9 Threshold Voltage Variation with Temperature.
Fig.10 Capacitance vs. Drain-Source Voltage.
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PPJX8872B
PART NO PACKING CODE VERSION
PART NO PACKING CODE
PJX8872B_R1_00002 PJX8872B_R2_00002
Package Type SOT-563 SOT-563
Packing type 8K pcs / 7” reel 20K pcs / 13” reel
Marking X2B X2B
Version Halogen free Halogen free
MOUNTING PAD LAYOUT
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PPJX8872B
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