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HV7361 Dataheets PDF



Part Number HV7361
Manufacturers Microchip
Logo Microchip
Description 2.5A Two-or-Three-Level Ultrasound Pulsers
Datasheet HV7361 DatasheetHV7361 Datasheet (PDF)

HV7360/HV7361 High-Speed ±100V 2.5A Two-or-Three-Level Ultrasound Pulsers Features • High-Density Integration AC-coupled Pulser • 0V to ±100V Output Voltage • ±2.5A Source and Sink Minimum Pulse Current • Up to 35 MHz Operating Frequency • 2 ns Matched Delay Times • 2.5V, 3.3V or 5V CMOS Logic Interface • Built-in Two-terminal Low-noise Interface for HV7361 • Low Power Consumption and No Floating Power Supply Rails or Decoupling Capacitors Applications • Medical Ultrasound Imaging • Piezoelect.

  HV7361   HV7361


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HV7360/HV7361 High-Speed ±100V 2.5A Two-or-Three-Level Ultrasound Pulsers Features • High-Density Integration AC-coupled Pulser • 0V to ±100V Output Voltage • ±2.5A Source and Sink Minimum Pulse Current • Up to 35 MHz Operating Frequency • 2 ns Matched Delay Times • 2.5V, 3.3V or 5V CMOS Logic Interface • Built-in Two-terminal Low-noise Interface for HV7361 • Low Power Consumption and No Floating Power Supply Rails or Decoupling Capacitors Applications • Medical Ultrasound Imaging • Piezoelectric Transducer Drivers • Ultrasound Industrial NDT • Pulse Waveform Generator General Description The HV7360/HV7361 are high-voltage and high-speed pulse generators with built-in, fast return-to-zero damping Field-Effect Transistors (FETs). An added feature to HV7361 is an integrated two-terminal low-noise T/R switch. These integrated circuits are designed not only for portable medical ultrasound image devices but also for NDT and test equipment applications. Both the HV7360/HV7361 are composed of controller logic interface circuits, level translators and AC-coupled Metal Oxide Semiconductor Field-Effect Transistor (MOSFET) gate drivers. They also have high-voltage and high-current P-channel and N-channel MOSFETs as output stages. The peak output currents of each channel are guaranteed to be over ±2.5A with up to ±100V of pulse swing. The AC coupling topology for the gate drivers not only saves two floating voltage supplies but also makes the PCB layout easier. Package Type 22-lead CABGA (Top view) See Table 2-1 for pad information.  2017 Microchip Technology Inc. DS20005570C-page 1 HV7360/HV7361 HV7360 Typical Application Circuit +10V +10V VDD VH VL3 +2.5/3.3V VLL PE INA INB 2.5/3.3V Logic Input INC IND GND VSS VL1 VL2 0 to +100V SP1 DP1 DN1 0 to -100V SN1 SP2 DP2 DN2 HVOUT SN2 +/-100V 2.5A Three-level RTZ Transmit Pulsers HV7361 Typical Application Circuit +10V +10V VDD VH VL3 +2.5/3.3V VLL PE INA INB 2.5/3.3V Logic Input INC IND 0 to +100V SP1 DP1 DN1 0 to -100V SN1 SP2 DP2 DN2 SN2 XDCR GND VSS VL1 VL2 RX T/R SW to Rx LNA +/-100V 2.5A Three-level RTZ Transmit Pulsers with T/R Switch DS20005570C-page 2  2017 Microchip Technology Inc. HV7360/HV7361 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Chip Power Supply Voltage, VDD–VSS .................................................................................................... –0.5 to +12.5V Output High Supply Voltage, VH ......................................................................................................VL–0.5 to VDD+0.5V Output Low Supply Voltage, VL..................................................................................................... VSS–0.5V to VH+0.5V Low-side Supply Voltage, VSS..................................................................................................................... –6V to +0.5V Differential High Voltage, VSP1–VSN1, VSP2–VSN2 ............................................................................................... +220V Positive High Voltage, VSP1,2 ................................................................................................................. –0.5V to +110V Negative High Voltage, VSN1,2 ............................................................................................................... +0.5V to –110V All Logic Input Voltages.............................................................................................................VSS–0.5V to GND +5.5V Rx to XDCR Differential Drop ............................................................................................................................... ±140V Coupling Capacitor Breakdown Voltage................................................................................................................ ±110V Maximum Junction Temperature, TJ ......................................................................................................................125°C Operating Ambient Temperature, TA ......................................................................................................–40°C to +85°C † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. OPERATING SUPPLY VOLTAGES AND CURRENT Electrical Specifications: GND = 0V, VH = VDD = +10V, VL = VSS = 0V, VPE = 3.3V, VPP = +100V, VNN = –100V, TA = 25°C unless otherwise specified. Parameter Sym. Min. Typ. Max. Unit Conditions Logic Supply Voltage Range VLL 2.25 — Supply Voltage VDD-VSS 4.75 — Low Side Supply Voltage VSS –5.5 — Gate Drive High-side Voltage VH VSS+4 .


HV7360 HV7361 STBC02


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