Power MOSFET
Advanced Power MOSFET
IRFW/I640A
FEATURES
Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacit...
Description
Advanced Power MOSFET
IRFW/I640A
FEATURES
Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacitance Improved Gate Charge Extended Safe Operating Area Lower Leakage Current : 10 µ A (Max.) @ VDS = 200V Lower RDS(ON) : 0.144 Ω (Typ.)
Absolute Maximum Ratings
Symbol VDSS ID IDM VGS EAS IAR EAR dv/dt
PD
TJ , TSTG
TL
Characteristic
Drain-to-Source Voltage
Continuous Drain Current (TC=25oC) Continuous Drain Current (TC=100oC)
Drain Current-Pulsed
O1
Gate-to-Source Voltage
Single Pulsed Avalanche Energy Avalanche Current
Repetitive Avalanche Energy Peak Diode Recovery dv/dt Total Power Dissipation (TA=25oC) * Total Power Dissipation (TC=25oC) Linear Derating Factor
O2 O1 O1 O3
Operating Junction and
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8 “ from case for 5-seconds
BVDSS = 200 V RDS(on) = 0.18 Ω ID = 18 A
D2-PAK I2-PAK
2
1 3
1 2 3
1. Gate 2. Drain 3. Source
Value 200 18 11.4 7.2 +_ 30 216 18 13.9 5.0 3.1 139 1.11
- 55 to +150
300
Units V
A
A V mJ A mJ V/ns W W W/oC
oC
Thermal Resistance
Symbol
Characteristic
Typ.
RθJC Junction-to-Case --
RθJA
Junction-to-Ambient *
--
RθJA Junction-to-Ambient
--
* When mounted on the minimum pad size recommended (PCB Mount).
Max. 0.9 40 62.5
Units oC/W
Rev. B
©1999 Fairchild Semiconductor Corporation
IRFW/I640A
N-CHANNEL POWER MOSFET
Electrical Characteristics (TC=25oC unless otherwise specified)
Symbol BVDSS
∆BV/ ∆TJ VGS(th)
IGSS
IDSS
RDS(on)
gfs Ciss C...
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