Document
Micron Confidential and Proprietary
2GB, 4GB, 8GB, 16GB, 32GB, 64GB: e·MMC Features
e·MMC™ Memory
MTFC2GMDEA-0M WT, MTFC4GLDEA-0M WT, MTFC4GMDEA-1M WT, MTFC8GLDEA-1M WT, MTFC16GJDEC-2M WT, MTFC32GJDED-3M WT, MTFC64GJDDN-3M WT
Features
• MultiMediaCard (MMC) controller and NAND Flash • 153- or 169-ball WFBGA/VFBGA/LFBGA (RoHS 6/6-
compliant) • VCC: 2.7–3.6V • VCCQ (dual voltage): 1.65–1.95V; 2.7–3.6V • Temperature ranges
– Operating temperature: –25˚C to +85˚C – Storage temperature: –40˚C to +85˚C • Typical current consumption – Standby current: 110µA for 2GB, 120µA for 4GB,
8GB, 16GB; 140µA for 32G; 160µA for 64GB – Active current (RMS): 70mA (2GB); 80mA (4GB,
8GB, 16GB, 32GB, 64GB)
MMC-Specific Features
• JEDEC/MMC standard version 4.41-compliant (JEDEC Standard No. 84-A441) – SPI mode not supported (see www.jedec.org/sites/default/files/ docs/JESD84-A441.pdf) – Advanced 11-signal interface – x1, x4, and x8 I/Os, selectable by host – MMC mode operation – Command classes: class 0 (basic); class 2 (block read); class 4 (block write); class 5 (erase); class 6 (write protection); class 7 (lock card) – MMCplus™ and MMCmobile™ protocols – Temporary write protection – 52 MHz clock speed (MAX) – Boot operation (high-speed boot) – Sleep mode – Replay-protected memory block (RPMB) – Secure erase and trim – Hardware reset signal – Multiple partitions with enhanced attribute – Permanent and power-on write protection – Double data rate (DDR) function – High-priority interrupt (HPI)
Figure 1: Micron e·MMC Device
MMC power
MMC controller
MMC interface
NAND Flash power
NAND Flash
MMC-Specific Features (Continued) – Enhanced reliable write – Configurable reliability settings – Background operation – Fully enhanced configurable – Backward-compatible with previous MMC modes
• ECC and block management implemented
PDF: 09005aef8523cb32 emmc_2gb-64gb_ctrd_441-wt.pdf - Rev. B 9/13 EN
1 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2013 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Confidential and Proprietary
2GB, 4GB, 8GB, 16GB, 32GB, 64GB: e·MMC Features
e·MMC Performance
Table 1: MLC Partition Performance
Condition Sequential write Sequential read Random write Random read
MTFC2GMDEA-0M WT MTFC4GLDEA-0M WT
6.6 30 90 1080
Part Number
MTFC4GMDEA-1M WT MTFC8GLDEA-1M WT
13.5 44 90 1080
MTFC16GJDEC-2M WT MTFC32GJDED-3M WT MTFC64GJDDN-3M WT
20
44
90
1100
Units MB/s MB/s IOPs IOPs
Note: 1. Bus in x8 I/O mode. Sequential access of 1MB chunk; random access of 4KB chunk. Additional performance data, such as power consumption or timing for different device modes, will be provided in a separate document upon customer request.
Ordering Information
Table 2: Ordering Information
Base Part Number Density MTFC2GMDEA-0M WT 2GB
MTFC4GLDEA-0M WT
4GB
MTFC4GMDEA-1M WT 4GB
MTFC8GLDEA-1M WT
8GB
MTFC16GJDEC-2M WT 16GB
MTFC32GJDED-3M WT 32GB
MTFC64GJDDN-3M WT 64GB
Package 153-ball WFBGA 11.5mm x 13.0mm x 0.8mm
153-ball WFBGA 11.5mm x 13.0mm x 0.8mm
153-ball WFBGA 11.5mm x 13.0mm x 0.8mm
153-ball WFBGA 11.5mm x 13.0mm x 0.8mm
169-ball WFBGA 14.0mm x 18.0mm x 0.8mm
169-ball VFBGA 14.0mm x 18.0mm x 1.0mm
169-ball LFBGA 14.0mm x 18.0mm x 1.4mm
NAND Flash Type
1 x 16Gb, MLC, 25nm
1 x 32Gb, MLC, 25nm
2 x 16Gb, MLC, 25nm
2 x 32Gb, MLC, 25nm
2 x 64Gb, MLC, 25nm
4 x 64Gb, MLC, 25nm
8 x 64Gb, MLC, 25nm
Shipping Media Tray
Tape and reel Tray
Tape and reel Tray
Tape and reel Tray
Tape and reel Tray
Tape and reel Tray
Tape and reel Tray
Tape and reel
PDF: 09005aef8523cb32 emmc_2gb-64gb_ctrd_441-wt.pdf - Rev. B 9/13 EN
2 Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2013 Micron Technology, Inc. All rights reserved.
Micron Confidential and Proprietary
2GB, 4GB, 8GB, 16GB, 32GB, 64GB: e·MMC Features
Part Numbering Information
Micron®e·MMC memory devices are available in different configurations and densities. Verify valid part numbers by using Micron’s part catalog search at www.micron.com. To compare features and specifications by device type, visit www.micron.com/products. Contact the factory for devices not found.
Figure 2: Marketing Part Number Chart
MT FC xx x x xx - xx xx x ES
Micron Technology FC = NAND Flash + Controller NAND Flash Density NAND Flash Component Controller ID Package Codes
Design Revision Production Status Wafer Process Applied Operating Temperature Range Special Options
Note: 1. Not all combinations are necessarily available. For a list of available devices or for further information on any aspect of these products, please contact your nearest Micron sales office.
Device Marking
Due to the size of the package, the Micron-standard part number is not printed on the top of the device. Instead, an abbreviated device mark consisting of a 5-digit alphanumeric code is used. The abbreviated device marks are cr.