Document
8700 E. Thomas Road Scottsdale, AZ 85251 Tel: (480) 941-6300 Fax: (480) 947-1503
FLIP-CHIP TVS DIODES
CHFP6KE5.0
thru
CHFP6KE170CA
FEATURES
• • • • • • Unidirectional and Bidirectional Fully glass passivated 600 watt (10/1000 µ s) Eliminates wire bonding NON Inductive Insertion No voltage overshoot
Patented Flip-Chip Series
MAXIMUM RATINGS
• • • • • • • Max Junction Temperature: 1500C (with conformal coating) Storage Temperature: -550C to +1500C Flip-Chip Peak Pulse Power: 600 Watts (10/1000 µ s) Maximum non-repetitive peak power 600 Watts (10/1000 µ s) Total continuous power dissipation 2.5 W (with adequate heat sink @ 750C) Turn-on time (theoretical) unidirectional 1X10-12 Turn-on time (theoretical) bidirectional 1X10-9
MECHANICAL • Weight: 0.01 grams (approximate)
• • Solderable standoff tabs .040X.040X.010 Waffle package 50 pices or wafer ring 70 pieces
PACKAGING
BIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm) FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT
UNIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm) FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT
VBR above 30 V
VBR 30V and below
MSC1596.PDF
ISO 9001 CERTIFIED
REV B 3/13/2000
CHFP6KE5.0 thru CHFP6KE170CA
PEAK PULSE POWER Vs PULSE TIME
Ppp – PEAK PULSE POWER – kW
PEAK PULSE POWER DERATING
TP – PULSE TIME – SEC TEMPERATURE °C
ATTACHMENT AND CONFORMAL COATING INSTRUCTIONS FOR Flip-Chip COMPONENTS
The .010” thick tab standoffs minimize shorting during attachment; however, minimal solder/conductive epoxy must be used and carefully controlled to prevent excess attachment material from wicking up the side of the tab and shorting across the junction. Maximum recommended solder temperatures are 212 C for IR reflow and 221 C for vapor-phase reflow. For flip-chip protection, coating material is Stycast ™ 2651-40 lowviscosity epoxy manufactured by Emerson & Cuming. Follow instructions carefully for preparation of the epoxy to prevent entrapment of air bubbles. Make sure that Flip-Chips have been baked at 100 C for 15 minutes minimum to out-gas any adsorbed moisture immediately prior to coating. Epoxy-coating material should be dispensed around the edges of the chip with an appropriately sized syringe after which epoxy is de-aired to remove bubbles entrapped beneath the chip. Cure epoxy as instructed by the supplier.
MSC1596.PDF
ISO 9001 CERTIFIED
Peak Pulse Power (PPP) or Current (IPP) In percent of 25° C rating
REV B 3/13/2000
CHFP6KE5.0 thru CHFP6KE170CA ELECTRICAL Characteristics @ 25 C Unless otherwise specified
Part Number Rated Stand-off Voltage VWM VOLTS CHFP6KE5.0 CHFP6KE5.0A CHFP6KE6.0 CHFP6KE6.0A CHFP6KE6.5 CHFP6KE6.5A CHFP6KE7.0 CHFP6KE7.0A CHFP6KE7.5 CHFP6KE7.5A CHFP6KE8.0 CHFP6KE8.0A CHFP6KE8.5 CHFP6KE8.5A CHFP6KE9.0 CHFP6KE9.0A CHFP6KE10 CHFP6KE10A CHFP6KE11 CHFP6KE11A CHFP6KE12 CHFP6KE12A CHFP6KE13 CHFP6KE13A CHFP6KE14 CHFP6KE14A CHFP6KE15 CHFP6KE15A CHFP6KE16 CHFP6KE16A CHFP6KE17 CHFP6KE17A CHFP6KE18 CHFP6KE18A CHFP6KE20 CHFP6KE20A CHFP6KE22 CHFP6KE22A CHFP6KE24 CHFP6KE24A .