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CHFP6KE22A Dataheets PDF



Part Number CHFP6KE22A
Manufacturers Microsemi Corporation
Logo Microsemi Corporation
Description Patented Flip-Chip Series
Datasheet CHFP6KE22A DatasheetCHFP6KE22A Datasheet (PDF)

8700 E. Thomas Road Scottsdale, AZ 85251 Tel: (480) 941-6300 Fax: (480) 947-1503 FLIP-CHIP TVS DIODES CHFP6KE5.0 thru CHFP6KE170CA FEATURES • • • • • • Unidirectional and Bidirectional Fully glass passivated 600 watt (10/1000 µ s) Eliminates wire bonding NON Inductive Insertion No voltage overshoot Patented Flip-Chip Series MAXIMUM RATINGS • • • • • • • Max Junction Temperature: 1500C (with conformal coating) Storage Temperature: -550C to +1500C Flip-Chip Peak Pulse Power: 600 Watts (10/100.

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8700 E. Thomas Road Scottsdale, AZ 85251 Tel: (480) 941-6300 Fax: (480) 947-1503 FLIP-CHIP TVS DIODES CHFP6KE5.0 thru CHFP6KE170CA FEATURES • • • • • • Unidirectional and Bidirectional Fully glass passivated 600 watt (10/1000 µ s) Eliminates wire bonding NON Inductive Insertion No voltage overshoot Patented Flip-Chip Series MAXIMUM RATINGS • • • • • • • Max Junction Temperature: 1500C (with conformal coating) Storage Temperature: -550C to +1500C Flip-Chip Peak Pulse Power: 600 Watts (10/1000 µ s) Maximum non-repetitive peak power 600 Watts (10/1000 µ s) Total continuous power dissipation 2.5 W (with adequate heat sink @ 750C) Turn-on time (theoretical) unidirectional 1X10-12 Turn-on time (theoretical) bidirectional 1X10-9 MECHANICAL • Weight: 0.01 grams (approximate) • • Solderable standoff tabs .040X.040X.010 Waffle package 50 pices or wafer ring 70 pieces PACKAGING BIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm) FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT UNIDIRECTIONAL ALL DIMENSIONS NOMINAL inches (mm) FLIP-CHIP DIMENSIONS PAD SIZE & CIRCUIT VBR above 30 V VBR 30V and below MSC1596.PDF ISO 9001 CERTIFIED REV B 3/13/2000 CHFP6KE5.0 thru CHFP6KE170CA PEAK PULSE POWER Vs PULSE TIME Ppp – PEAK PULSE POWER – kW PEAK PULSE POWER DERATING TP – PULSE TIME – SEC TEMPERATURE °C ATTACHMENT AND CONFORMAL COATING INSTRUCTIONS FOR Flip-Chip COMPONENTS The .010” thick tab standoffs minimize shorting during attachment; however, minimal solder/conductive epoxy must be used and carefully controlled to prevent excess attachment material from wicking up the side of the tab and shorting across the junction. Maximum recommended solder temperatures are 212 C for IR reflow and 221 C for vapor-phase reflow. For flip-chip protection, coating material is Stycast ™ 2651-40 lowviscosity epoxy manufactured by Emerson & Cuming. Follow instructions carefully for preparation of the epoxy to prevent entrapment of air bubbles. Make sure that Flip-Chips have been baked at 100 C for 15 minutes minimum to out-gas any adsorbed moisture immediately prior to coating. Epoxy-coating material should be dispensed around the edges of the chip with an appropriately sized syringe after which epoxy is de-aired to remove bubbles entrapped beneath the chip. Cure epoxy as instructed by the supplier. MSC1596.PDF ISO 9001 CERTIFIED Peak Pulse Power (PPP) or Current (IPP) In percent of 25° C rating REV B 3/13/2000 CHFP6KE5.0 thru CHFP6KE170CA ELECTRICAL Characteristics @ 25 C Unless otherwise specified Part Number Rated Stand-off Voltage VWM VOLTS CHFP6KE5.0 CHFP6KE5.0A CHFP6KE6.0 CHFP6KE6.0A CHFP6KE6.5 CHFP6KE6.5A CHFP6KE7.0 CHFP6KE7.0A CHFP6KE7.5 CHFP6KE7.5A CHFP6KE8.0 CHFP6KE8.0A CHFP6KE8.5 CHFP6KE8.5A CHFP6KE9.0 CHFP6KE9.0A CHFP6KE10 CHFP6KE10A CHFP6KE11 CHFP6KE11A CHFP6KE12 CHFP6KE12A CHFP6KE13 CHFP6KE13A CHFP6KE14 CHFP6KE14A CHFP6KE15 CHFP6KE15A CHFP6KE16 CHFP6KE16A CHFP6KE17 CHFP6KE17A CHFP6KE18 CHFP6KE18A CHFP6KE20 CHFP6KE20A CHFP6KE22 CHFP6KE22A CHFP6KE24 CHFP6KE24A .


CHFP6KE22 CHFP6KE22A CHFP6KE24


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