VIB0003TFJ

VIB0003TFJ BCMTM DC to DC Bus Converter Module PRELIMINARY DATASHEET S C NRTL US FEATURES 352 Vdc – 44 Vdc 325 W Bus Converter Module High efficiency (>95%) reduces system power consumption High power density (>1000 W/in3) reduces power system footprint by >40% “Full Chip” VI Chip package enables surface mount, low impedance interconnect to system board Contains built-in protection features: undervoltage, overvoltage lockout, overcurrent protection, short circuit protection, overtemperature protection. Provides enable/disable control, internal temperature monitoring ZVS/ZCS Resonant Sine Amplitude Converter topology Can be paralleled to create multi-kW arrays TYPICAL APPLICATIONS High End Computing Systems Automated Test Equipment Telecom Base Stations High Density Power Supplies Communications Systems DESCRIPTION The VI Chip Bus Converter Module is a high efficiency (>95%) Sine Amplitude Converter (SAC)TM operating from a 330 to 365 Vdc primary bus to deliver an isolated 41.25 – 45.63 V nominal, unregulated secondary. The SAC offers a low AC impedance beyond the bandwidth of most downstream regulators, meaning that input capacitance normally located at the input of a regulator can be located at the input to the SAC. Since the K factor of the VIB0003TFJ is 1/8, that capacitance value can be reduced by a factor of 64x, resulting in savings of board area, materials and total system cost. The VIB0003TFJ is provided in a VI Chip package compatible ...