THGBM4G7D2GBAIE

THGBM4G7D2GBAIE 16GB THGBM4G7D2GBAIE INTRODUCTION TOSHIBA e-MMC Module THGBM4G7D2GBAIE is 16-GByte density of e-MMC Module product housed in 169 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM4G7D2GBAIE has an industry standard MMC protocol for easy use. FEATURES THGBM4G7D2GBAIE Interface THGBM4G7D2GBAIE has the JEDEC/MMCA Version 4.41 interface with either 1-I/O, 4-I/O and 8-I/O mode support. Pin Connection P-TFBGA169-1216-0.50A4 (12 x 16mm, H1.2mm max. package) 14 13 NC 12 11 NC 10 9 NC 8 7 6 NC 5 4 NC 3 2 NC 1 NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC RFU RFU RFU Vss Vcc RFU NC NC RFU NC NC NC RFU Vcc NC NC NC NC NC NC RFU NC NC RFU Vss Top View Vss RFU NC NC NC NC NC RFU RFU DAT7 VccQ Vcc RFU CLK NC VssQ DAT2 DAT6 RFU RFU Vcc Vss RFU RFU RST_n CMD VssQ VccQ DAT1 DAT5 VssQ NC Index VccQ VccQ VssQ DAT0 DAT4 NC NC NC NC RFU NC NC NC NC NC NC VccQ NC DAT3 VDDi NC NC NC NC NC NC NC NC NC VssQ NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC NC A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG AH Pin Number Name Pin Number Name Pin Number H3 DAT0 K2 VDDi T10 H4 DAT1 K4 VssQ U5 H5 DAT2 K6 VccQ U8 J2 DAT3 M6 Vcc U9 J3 DAT4 M7 Vss W4 J4 DAT5 N5 Vcc W5 J5 DAT6 P5 Vss W6 J6 DAT7 R10 Vss Y2 NC: No Con...