TMD3N50Z

Features  Low gate charge  100% avalanche tested  Improved dv/dt capability  RoHS compliant  Halogen free package  JEDEC Qualification D-PAK TMD3N50Z(G)/TMU3N50Z(G) BVDSS 500V N-channel MOSFET ID RDS(on) 2.5A <2.8W I-PAK Device TMD3N50Z / TMU3N50Z TMD3N50ZG / TMU3N50ZG Package D-PAK/I-PAK D-PAK/I-PAK Absolute Maximum Ratings Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current (Note 1) TC = 25 ℃ TC = 100 ℃ Single Pulse Avalanche Energy (Note 2) Repetitive Avalanche Current (Note 1) Repetitive Avalanche Energy (Note 1) Power Dissipation TC = 25 ℃ Derate above 25 ℃ Peak Diode Recovery dv/dt (Note 3) Operating Junction and Storage Temperature Range Maximum lead temperature for soldering purposes, 1/8” from case for 5 seconds * Limited only by maximum junction temperature Marking TMD3N50Z / TMU3N50Z TMD3N50ZG / TMU3N50ZG Remark RoHS Halogen Free Symbol VDSS VGS ID IDM EAS IAR EAR PD dv/dt TJ, TSTG TL TMD3N50Z(G)/TMU3N50Z(G) 500 ±30 2.5 1.8 10 107 2.5 5.2 52 0.41 4.5 -55~150 300 Unit V V A A A mJ A mJ W W/℃ V/ns ℃ ℃ Thermal Characteristics Parameter Maximum Thermal resistance, Junction-to-Case Maximum Thermal resistance, Junction-to-Ambient Symbol RqJC RqJA May 2012 : Rev0 www.trinnotech.com TMD3N50Z(G)/TMU3N50Z(G) 2.4 110 Unit ℃/W ℃/W 1/6 TMD3N50Z(G)/TMU3N50Z(G) Electrical Characteristics : TC=25℃, unless otherwise noted Parameter Symbol Test condition Min Typ Max Units OFF Drain-Source Br...