Document
PZUxBA series
Single Zener diodes
Rev. 01 — 19 September 2008
Product data sheet
1. Product profile
1.1 General description
General-purpose Zener diodes in a SOD323 (SC-76) very small Surface-Mounted Device (SMD) plastic package.
1.2 Features
I Non-repetitive peak reverse power dissipation: PZSM ≤ 40 W
I Total power dissipation: Ptot ≤ 320 mW
I Tolerance series: B: approximately ±5 %; B1, B2, B3: approximately ±2 %
I Wide working voltage range: nominal 2.4 V to 36 V (E24 range)
I Low reverse current IR range
I Small plastic package suitable for surface-mounted design
I AEC-Q101 qualified
1.3 Applications
I General regulation functions
1.4 Quick reference data
Table 1. Symbol VF PZSM
Ptot
Quick reference data
Parameter
Conditions
forward voltage
IF = 100 mA
non-repetitive peak reverse power dissipation
total power dissipation
Tamb ≤ 25 °C
Min Typ Max Unit [1] - - 1.1 V [2] - - 40 W
[3] - - 320 mW
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02. [2] tp = 100 µs; square wave; Tj = 25 °C prior to surge
[3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
NXP Semiconductors
PZUxBA series
Single Zener diodes
2. Pinning information
Table 2. Pin 1 2
Pinning Description cathode anode
[1] The marking bar indicates the cathode.
3. Ordering information
Simplified outline
[1] 12
Graphic symbol
12 006aaa152
Table 3. Ordering information
Type number
Package
Name
Description
PZU2.4BA to PZU36BA[1]
SC-76
plastic surface-mounted package; 2 leads
PZU2.4BA/DG to PZU36BA/DG[1][2]
[1] The series consists of 97 types with nominal working voltages from 2.4 V to 36 V. [2] /DG: halogen-free
Version SOD323
PZUXBA_SER_1
Product data sheet
Rev. 01 — 19 September 2008
© NXP B.V. 2008. All rights reserved.
2 of 14
NXP Semiconductors
PZUxBA series
Single Zener diodes
4. Marking
Table 4. Marking codes
Type number[1] Marking code
Type number[1]
B B1 B2 B3
PZU2.4*A
X8 - - - PZU2.4*A/DG
PZU2.7*A
X9 XA XB -
PZU2.7*A/DG
PZU3.0*A
XT XU XV -
PZU3.0*A/DG
PZU3.3*A
XW XX XY -
PZU3.3*A/DG
PZU3.6*A
XZ MC MD -
PZU3.6*A/DG
PZU3.9*A
ME MF MG -
PZU3.9*A/DG
PZU4.3*A
MM MN MP MR PZU4.3*A/DG
PZU4.7*A
MS MT MU MV PZU4.7*A/DG
PZU5.1*A
MW MX MY MZ PZU5.1*A/DG
PZU5.6*A
LF LG LH LK PZU5.6*A/DG
PZU6.2*A
LL LM LN LP PZU6.2*A/DG
PZU6.8*A
LR LS LT LU PZU6.8*A/DG
PZU7.5*A
LV LW LX LY PZU7.5*A/DG
PZU8.2*A
LZ CR CS CT PZU8.2*A/DG
PZU9.1*A
CU CV CW CX PZU9.1*A/DG
PZU10*A
VA VB VC VD PZU10*A/DG
PZU11*A
VE VF VG VH PZU11*A/DG
PZU12*A
VK VL VM VN PZU12*A/DG
PZU13*A
VP VR VS VT PZU13*A/DG
PZU14*A
- - VU - PZU14*A/DG
PZU15*A
VV VW VX VY PZU15*A/DG
PZU16*A
VZ X1 X2 X3 PZU16*A/DG
PZU18*A
X4 X5 X6 X7 PZU18*A/DG
PZU20*A
XC XD XE XF PZU20*A/DG
PZU22*A
XG XH XK XL PZU22*A/DG
PZU24*A
XM XN XP XR PZU24*A/DG
PZU27*A
XS - - - PZU27*A/DG
PZU30*A
MH - - - PZU30*A/DG
PZU33*A
MK - - - PZU33*A/DG
PZU36*A
ML - - - PZU36*A/DG
[1] * = B: tolerance series B, approximately ±5 % * = B1, B2, B3: tolerance series B1, B2, B3: approximately ±2 %
Marking code
B B1 B2
Y8 -
-
Y9 YA YB
YT YU YV
YW YX YY
YZ NC ND
NE NF NG
NM NN NP
NS NT NU
NW NX NY
RF RG RH
RL RM RN
RR RS RT
RV RW RX
RZ ER ES
EU EV EW
WA WB WC
WE WF WG
WK WL WM
WP WR WS
- - WU
WV WW WX
WZ Y1 Y2
Y4 Y5 Y6
YC YD YE
YG YH YK
YM YN YP
YS -
-
NH -
-
NK -
-
NL -
-
B3 NR NV NZ RK RP RU RY ET EX WD WH WN WT WY Y3 Y7 YF YL YR -
PZUXBA_SER_1
Product data sheet
Rev. 01 — 19 September 2008
© NXP B.V. 2008. All rights reserved.
3 of 14
NXP Semiconductors
PZUxBA series
Single Zener diodes
5. Limiting values
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
IF forward current
IZSM non-repetitive peak reverse current
[1] -
PZSM
Ptot
Tj Tamb Tstg
non-repetitive peak reverse power dissipation
total power dissipation
Tamb ≤ 25 °C
junction temperature ambient temperature storage temperature
[1] -
[2] [3] -
−55 −65
Max
200
see Table 8 and 9
40
Unit mA
W
320 490 150 +150 +150
mW mW °C °C °C
[1] tp = 100 µs; square wave; Tj = 25 °C prior to surge [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
Table 6. Symbol Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to ambient
Rth(j-sp)
thermal resistance from junction to solder point
Conditions in free air
Min Typ Max Unit [1] - - 390 K/W [2] - - 255 K/W [3] - - 55 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [3] Soldering point of cathode tab.
7. Characteristics
Table 7. Characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter VF forward voltage
[1] Pulse test: tp ≤ 30.