Chip Carrier Socket
3M Chip Carrier Socket
4-Row, Thru-hole
PLCCE Series
S Low profile .200″ maximum height S Designed for automatic asse...
Description
3M Chip Carrier Socket
4-Row, Thru-hole
PLCCE Series
S Low profile .200″ maximum height S Designed for automatic assembly S High temperature insulator compatible with
IR reflow and wave soldering S Open frame allows visual inspection of solder
joints
Date Modified:March 10, 2003
Physical
Insulation Material: Glass Filled PPS
Flammability: UL 94V-0 Color: Black, Brown
Contact Material: Phosphor Bronze
Plating Underplating: 50 µ″, [ 1.3 µm ] Nickel Wiping Area: 100 µ″, [ 2.5 µm ] Tin/Lead Solder Tail Area: 200 µ″, [ 5.1 µm ] Tin/Lead
Electrical
Contact Resistance: 20 mΩ Insulation Resistance: 103 MΩ min. at 500 VDC
Capacitance: 1 pF
Environmental
Temperature Rating: --55°C to +105°C
TS-1156-01 Sheet 1 of 3
UL File No.: E68080
3
Interconnect Solutions http://www.3M.com/interconnects/
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3M Chip Carrier Socket
4-Row, Thru-hole
Pin No. 1
A C .050 1.27 TYP.
PLCCE Series
.130 3.30
.110 2.79
BD
OJ Drain Holes
NOTE: 20, 28, & 32 SIZES HAVE ONLY ONE DRAIN HOLE IN THE CENTER
.320 8.13
.015 .38
0.012 X 0.007 [.30 X .18] Rectangular Pins
Inch
[mm] Tolerance Unless Noted
.0 .00 .000 Inch ± .1 ± .01 ± .005
[ ] Dimensions for Reference only
Contact Quantity
20 28 32 44 52 68 84
DESCRIPTION
PLCCE-020-S1-TT PLCCE-028-S1-TT PLCCE-032-S1-TT PLCCE-044-S1-TT PLCCE-052-S1-TT PLCCE-068-S1-TT PLCCE-084-S1-TT
A
.590 [14.99] 0.690 [17.53] 0.690 [17.53] 0.890 [22.61] 0.990 [25.15] 1.1...
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