ON Semiconductor Electronic Components Datasheet  


2N3904

General Purpose Transistors(NPN Silicon)


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2N3903, 2N3904
General Purpose
Transistors
NPN Silicon
Features
PbFree Packages are Available*
MAXIMUM RATINGS
Rating
Symbol Value
Unit
Collector Emitter Voltage
Collector Base Voltage
Emitter Base Voltage
Collector Current Continuous
Total Device Dissipation
@ TA = 25°C
Derate above 25°C
VCEO
VCBO
VEBO
IC
PD
40 Vdc
60 Vdc
6.0 Vdc
200 mAdc
625 mW
5.0 mW/°C
Total Device Dissipation
@ TC = 25°C
Derate above 25°C
PD 1.5 W
12 mW/°C
Operating and Storage Junction
Temperature Range
TJ, Tstg 55 to +150
°C
THERMAL CHARACTERISTICS (Note 1)
Characteristic
Symbol
Max
Unit
Thermal Resistance, JunctiontoAmbient RqJA 200 °C/W
Thermal Resistance, JunctiontoCase
RqJC
83.3
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Indicates Data in addition to JEDEC Requirements.
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COLLECTOR
3
2
BASE
1
EMITTER
TO92
CASE 29
STYLE 1
123
STRAIGHT LEAD
BULK PACK
12 3
BENT LEAD
TAPE & REEL
AMMO PACK
MARKING DIAGRAMS
2N
390x
YWWG
G
x = 3 or 4
Y = Year
WW = Work Week
G = PbFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2012
August, 2012 Rev. 8
1
Publication Order Number:
2N3903/D


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2N3903, 2N3904
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Collector Emitter Breakdown Voltage (Note 2) (IC = 1.0 mAdc, IB = 0)
Collector Base Breakdown Voltage (IC = 10 mAdc, IE = 0)
Emitter Base Breakdown Voltage (IE = 10 mAdc, IC = 0)
Base Cutoff Current (VCE = 30 Vdc, VEB = 3.0 Vdc)
Collector Cutoff Current (VCE = 30 Vdc, VEB = 3.0 Vdc)
ON CHARACTERISTICS
DC Current Gain (Note 2)
(IC = 0.1 mAdc, VCE = 1.0 Vdc)
(IC = 1.0 mAdc, VCE = 1.0 Vdc)
(IC = 10 mAdc, VCE = 1.0 Vdc)
(IC = 50 mAdc, VCE = 1.0 Vdc)
(IC = 100 mAdc, VCE = 1.0 Vdc)
2N3903
2N3904
2N3903
2N3904
2N3903
2N3904
2N3903
2N3904
2N3903
2N3904
Collector Emitter Saturation Voltage (Note 2)
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc
Base Emitter Saturation Voltage (Note 2)
(IC = 10 mAdc, IB = 1.0 mAdc)
(IC = 50 mAdc, IB = 5.0 mAdc)
SMALLSIGNAL CHARACTERISTICS
Current Gain Bandwidth Product
(IC = 10 mAdc, VCE = 20 Vdc, f = 100 MHz)
2N3903
2N3904
Output Capacitance (VCB = 5.0 Vdc, IE = 0, f = 1.0 MHz)
Input Capacitance (VEB = 0.5 Vdc, IC = 0, f = 1.0 MHz)
Input Impedance
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
2N3903
2N3904
Voltage Feedback Ratio
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
2N3903
2N3904
SmallSignal Current Gain
(IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
2N3903
2N3904
Output Admittance (IC = 1.0 mAdc, VCE = 10 Vdc, f = 1.0 kHz)
Noise Figure
(IC = 100 mAdc, VCE = 5.0 Vdc, RS = 1.0 k W, f = 1.0 kHz)
2N3903
2N3904
SWITCHING CHARACTERISTICS
Delay Time
Rise Time
(VCC = 3.0 Vdc, VBE = 0.5 Vdc,
IC = 10 mAdc, IB1 = 1.0 mAdc)
Storage Time
I(BV1C=C
= 3.0
IB2 =
1V.d0cm, IACd=c)10
mAdc,
Fall Time
2. Pulse Test: Pulse Width v 300 ms; Duty Cycle v 2%.
2N3903
2N3904
Symbol
V(BR)CEO
V(BR)CBO
V(BR)EBO
IBL
ICEX
hFE
VCE(sat)
VBE(sat)
fT
Cobo
Cibo
hie
hre
hfe
hoe
NF
td
tr
ts
tf
Min
40
60
6.0
20
40
35
70
50
100
30
60
15
30
0.65
250
300
1.0
1.0
0.1
0.5
50
100
1.0
Max Unit
Vdc
Vdc
Vdc
50 nAdc
50 nAdc
150
300
Vdc
0.2
0.3
Vdc
0.85
0.95
MHz
4.0 pF
8.0 pF
kW
8.0
10
X 104
5.0
8.0
200
400
40 mmhos
dB
6.0
5.0
35 ns
35 ns
175 ns
200
50 ns
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2N3903, 2N3904
ORDERING INFORMATION
Device
Package
Shipping
2N3903RLRM
TO92
2000 / Ammo Pack
2N3904
TO92
5000 Units / Bulk
2N3904G
TO92
(PbFree)
5000 Units / Bulk
2N3904RLRA
TO92
2000 / Tape & Reel
2N3904RLRAG
TO92
(PbFree)
2000 / Tape & Reel
2N3904RLRM
TO92
2000 / Ammo Pack
2N3904RLRMG
TO92
(PbFree)
2000 / Ammo Pack
2N3904RLRP
TO92
2000 / Ammo Pack
2N3904RLRPG
TO92
(PbFree)
2000 / Ammo Pack
2N3904RL1G
TO92
(PbFree)
2000 / Tape & Reel
2N3904ZL1
TO92
2000 / Ammo Pack
2N3904ZL1G
TO92
(PbFree)
2000 / Ammo Pack
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
DUTY CYCLE = 2%
300 ns
- 0.5 V
+10.9 V
10 k
< 1 ns
+3 V
275
CS < 4 pF*
* Total shunt capacitance of test jig and connectors
Figure 1. Delay and Rise Time Equivalent Test Circuit
10 < t1 < 500 ms
DUTY CYCLE = 2%
t1
+10.9 V
+3 V
275
10 k
0
1N916
CS < 4 pF*
- 9.1 V
< 1 ns
* Total shunt capacitance of test jig and connectors
Figure 2. Storage and Fall Time Equivalent Test Circuit
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2N3903, 2N3904
TYPICAL TRANSIENT CHARACTERISTICS
10
7.0
5.0
Cibo
3.0
2.0 Cobo
1.0
0.1
0.2 0.3 0.5 0.7 1.0 2.0 3.0 5.0 7.0 10
REVERSE BIAS VOLTAGE (VOLTS)
Figure 3. Capacitance
TJ = 25°C
TJ = 125°C
5000
3000
2000
VCC = 40 V
IC/IB = 10
20 30 40
1000
700
500
300
200
100
70
50
1.0
QT
QA
2.0 3.0 5.0 7.0 10 20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
Figure 4. Charge Data
200
500
300 IC/IB = 10
200
100
70
50
30
20
10
7
5
1.0
tr @ VCC = 3.0 V
40 V
15 V
td @ VOB = 0 V
2.0 V
2.0 3.0 5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
Figure 5. Turn On Time
200
500
300 VCC = 40 V
200 IC/IB = 10
100
70
50
30
20
10
7
5
1.0
2.0 3.0 5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
Figure 6. Rise Time
200
500
300
200 IC/IB = 20
IC/IB = 10
ts = ts - 1/8 tf
IB1 = IB2
100
70
50 IC/IB = 20
30 IC/IB = 10
20
10
7
5
1.0
2.0 3.0 5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
Figure 7. Storage Time
200
500
300
200
100
70
50
30
20
10
7
5
1.0
IC/IB = 20
VCC = 40 V
IB1 = IB2
IC/IB = 10
2.0 3.0 5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
Figure 8. Fall Time
200
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2N3903, 2N3904
TYPICAL AUDIO SMALLSIGNAL CHARACTERISTICS
NOISE FIGURE VARIATIONS
(VCE = 5.0 Vdc, TA = 25°C, Bandwidth = 1.0 Hz)
12
SOURCE RESISTANCE = 200 W
10 IC = 1.0 mA
14
12 f = 1.0 kHz IC = 1.0 mA
8 SOURCE RESISTANCE = 200 W
IC = 0.5 mA
6 SOURCE RESISTANCE = 1.0 k
IC = 50 mA
4
10 IC = 0.5 mA
8
6
4
IC = 50 mA
IC = 100 mA
2 SOURCE RESISTANCE = 500 W
IC = 100 mA
0
0.1 0.2 0.4
1.0 2.0 4.0
10 20 40
f, FREQUENCY (kHz)
Figure 9.
100
2
0
0.1 0.2
0.4 1.0 2.0 4.0 10 20
RS, SOURCE RESISTANCE (k OHMS)
Figure 10.
40
100
h PARAMETERS
(VCE = 10 Vdc, f = 1.0 kHz, TA = 25°C)
300 100
50
200
20
100 10
70 5
50
2
30
0.1
0.2 0.3 0.5 1.0 2.0 3.0
IC, COLLECTOR CURRENT (mA)
Figure 11. Current Gain
5.0
10
1
0.1 0.2 0.3 0.5 1.0 2.0 3.0 5.0 10
IC, COLLECTOR CURRENT (mA)
Figure 12. Output Admittance
20
10
5.0
2.0
1.0
0.5
0.2
0.1
0.2 0.3 0.5 1.0 2.0 3.0
IC, COLLECTOR CURRENT (mA)
5.0
Figure 13. Input Impedance
10
10
7.0
5.0
3.0
2.0
1.0
0.7
0.5
0.1
0.2 0.3 0.5 1.0 2.0 3.0
IC, COLLECTOR CURRENT (mA)
5.0
Figure 14. Voltage Feedback Ratio
10
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2N3903, 2N3904
TYPICAL STATIC CHARACTERISTICS
2.0
TJ = +125°C
1.0 +25°C
0.7
0.5 - 55°C
0.3
0.2
VCE = 1.0 V
0.1
0.1
0.2 0.3
0.5 0.7 1.0
2.0 3.0
5.0 7.0 10
IC, COLLECTOR CURRENT (mA)
Figure 15. DC Current Gain
20 30
50 70 100
200
1.0
0.8
0.6
0.4
0.2
0
0.01
IC = 1.0 mA
10 mA
30 mA
0.02 0.03
0.05 0.07 0.1
0.2 0.3
0.5 0.7 1.0
IB, BASE CURRENT (mA)
Figure 16. Collector Saturation Region
TJ = 25°C
100 mA
2.0 3.0
5.0 7.0 10
1.2
TJ = 25°C
1.0
VBE(sat) @ IC/IB =10
0.8
VBE @ VCE =1.0 V
0.6
0.4
VCE(sat) @ IC/IB =10
0.2
0
1.0 2.0
5.0 10 20
50 100 200
IC, COLLECTOR CURRENT (mA)
Figure 17. “ON” Voltages
1.0
0.5
qVC FOR VCE(sat)
0
- 0.5
- 1.0
- 1.5 qVB FOR VBE(sat)
+25°C TO +125°C
- 55°C TO +25°C
- 55°C TO +25°C
+25°C TO +125°C
- 2.0
0
20 40 60 80 100 120 140 160 180 200
IC, COLLECTOR CURRENT (mA)
Figure 18. Temperature Coefficients
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2N3903, 2N3904
PACKAGE DIMENSIONS
A
R
SEATING
PLANE
B
P
L
K
XX
H
V
G
C
1
N
N
TO92 (TO226)
CASE 2911
ISSUE AM
STRAIGHT LEAD
BULK PACK
D
J
SECTION XX
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
INCHES
DIM MIN MAX
A 0.175 0.205
B 0.170 0.210
C 0.125 0.165
D 0.016 0.021
G 0.045 0.055
H 0.095 0.105
J 0.015 0.020
K 0.500 ---
L 0.250 ---
N 0.080 0.105
P --- 0.100
R 0.115 ---
V 0.135 ---
MILLIMETERS
MIN MAX
4.45 5.20
4.32 5.33
3.18 4.19
0.407 0.533
1.15 1.39
2.42 2.66
0.39 0.50
12.70 ---
6.35 ---
2.04 2.66
--- 2.54
2.93 ---
3.43 ---
RAB
P
T
SEATING
PLANE
K
XX
G
V
1
C
N
BENT LEAD
TAPE & REEL
AMMO PACK
D
J
SECTION XX
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.
MILLIMETERS
DIM MIN MAX
A 4.45 5.20
B 4.32 5.33
C 3.18 4.19
D 0.40 0.54
G 2.40 2.80
J 0.39 0.50
K 12.70 ---
N 2.04 2.66
P 1.50 4.00
R 2.93 ---
V 3.43 ---
STYLE 1:
PIN 1.
2.
3.
EMITTER
BASE
COLLECTOR
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
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2N3903/D




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