X006 Datasheet PDF
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X006 Series
0.8A SCRs
SENSITIVE
Main features
Symbol
www.DataSheet4U.com
IT(RMS)
VDRM/VRRM
IGT
Value
0.8
600
60 to 200
Unit
A
V
µA
Description
Thanks to highly sensitive triggering levels, the
X006 SCR series is suitable for all applications
where the available gate current is limited, such
as ground fault circuit interrupters, overvoltage
crowbar protection in low power supplies,
capacitive ignition circuits, ...
Available in though-hole or surface-mount
packages, these devices are optimized in forward
voltage drop and inrush current capabilities, for
reduced power losses and high reliability in harsh
environments.
A
G
K
KGA
TO-92
(X006xxA)
Order codes
Part Numbers
X00602MA 1AA2
X00602MA 2AL2
X00602MA 5AL2
X00602MN5BA4
X00605MA 1AA2
A
AG
K
SOT-223
(X006xxN)
Marking
X0602 MA
X0602 MA
X0602 MA
X06 2M
X0605 MA
August 2006
Rev 4
1/10
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Characteristics
1 Characteristics
X006 Series
Table 1.
Symbol
Absolute ratings (limiting values)
Parameter
Value
Unit
IT(RMS) RMS on-state current (180° conduction angle)
IT(AV) Average on-state current (180° conduction angle)
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ITSM Non repetitive surge peak on-state current
I²t I²t Value for fusing
dI/dt
IGM
PG(AV)
Tstg
Tj
Critical rate of rise of on-state current
IG = 2 x IGT , tr 100 ns
Peak gate current
Average gate power dissipation
Storage junction temperature range
Operating junction temperature range
TO-92
Tl = 85° C
SOT-223 Ttab = 100° C
TO-92
Tl = 85° C
SOT-223 Ttab = 100° C
tp = 8.3 ms
Tj = 25° C
tp = 10 ms
tp = 10 ms Tj = 25° C
0.8
0.5
10
9
0.4
A
A
A
A2S
F = 60 Hz Tj = 125° C
50 A/µs
tp = 20 µs
Tj = 125° C
Tj = 125° C
1
0.1
- 40 to + 150
- 40 to + 125
A
W
°C
Table 2.
Symbol
Electrical characteristics
Test Conditions
X00602 X00605 Unit
IGT
VGT
VGD
VRG
IH
IL
dV/dt
VTM
Vt0
Rd
IDRM
IRRM
VD = 12 V RL = 140
VD = VDRM RL = 3.3 kRGK = 1 k
IRG = 10 µA
IT = 50 mA RGK = 1 k
IG = 1 mA
RGK = 1 k
VD = 67% VDRM RGK = 1 k
ITM = 1 A tp = 380 µs
Threshold voltage
Dynamic resistance
VDRM = VRRM RGK = 1 k
Tj = 125° C
Tj = 125° C
Tj = 25° C
Tj = 125° C
Tj = 125° C
Tj = 25° C
Tj = 125° C
MIN.
MAX.
MAX.
MIN.
MIN.
MAX.
MAX.
MIN.
MAX.
MAX.
MAX.
MAX.
MAX.
15 30
200 60
0.8
0.2
5
5
6
25
1.35
0.85
245
1
100
µA
V
V
V
mA
mA
V/µs
V
V
m
µA
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X006 Series
Characteristics
Table 3.
Symbol
Thermal resistances
Rth(j-a) Junction to ambient (D.C.)
Rth(j-l)
Rth(j-t)
Junction to lead (D.C.)
Junction to tab (DC)
Parameter
S = 5 cm2
TO-92
SOT-223
TO-92
SOT-223
Value
150
60
70
30
Unit
°C/W
Figure 1.
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Maximum average power
Figure 2.
dissipation versus average on-state
current
Average and D.C. on-state current
versus case temperature (TO-92)
P(W)
0.6
α = 180°
0.5
0.4
0.3
0.2
0.1
0.0
0.0
0.1
IT(AV)(A)
0.2 0.3
0.4
360°
α
0.5 0.6
IT(AV)(A)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
25
D.C.
α = 180°
TO-92
Tl(°C)
50 75
100 125
Figure 3.
Average and D.C. on-state current Figure 4.
versus ambient temperature (epoxy
printed circuit board FR4, copper
thickness eCU=35 µm, SCU= 0.5
cm2) (TO-92)
Average and D.C. on-state current
versus casetemperature (SOT-223)
IT(AV)(A)
1.0
0.9
D.C.
0.8
0.7
0.6
α = 180°
0.5
0.4
0.3
0.2
0.1
0.0
0
25
Tamb(°C)
50 75
TO-92
SCU = 0.5 cm2
100 125
IT(AV)(A)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
25
D.C.
α = 180°
SOT-223
Ttab(°C)
50 75
100 125
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Characteristics
X006 Series
Figure 5.
Average and D.C. on-state current Figure 6.
versus ambient temperature (epoxy
printed circuit board FR4, copper
thickness eCU=35 µm, SCU=5 cm2)
(SOT-223)
Relative variation of thermal
impedance junction to ambient
versus pulse duration (printed
cSiCrcUu=i0t.5bocamrd2)F(RTO4,-9e2C)U=35 µm,
IT(AV)(A)
1.0
0.9
D.C.
0.8
SOT-223
SCU = 0.5 cm2
Zth(j-a)/Rth(j-a)
1.00
TO-92
SCU = 0.5 cm2
0.7
0.6
0.5
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0.4
α = 180°
0.10
0.3
0.2
0.1
0.0
0
Tamb(°C)
tp(s)
0.01
25 50 75 100 125
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
Figure 7.
Relative variation of thermal
impedance junction to ambient
versus pulse duration (printed
cSiCrcUu=i0t.5bocamrd2)F(RSO4,Te-2C2U3=)35 µm,
Zth(j-a)/Rth(j-a)
1.00
SOT-223
SCU = 0.5 cm2
0.10
0.01
1.E-03
1.E-02
1.E-01
tp(s)
1.E+00
1.E+01
1.E+02
1.E+03
Figure 8.
Thermal resistance junction to
ambient versus copper surface
under tab (printed circuit board
FR4, eCU=35 µm) (SOT-223)
Rth(j-a)(°C/W)
130
120
110
100
90
80
70
60
50
40
30
20
10 S(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Figure 9.
Relative variation of gate trigger
current, holding current and
latching current versus junction
temperature (typical values)
IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C]
1.6
1.4
1.2
1.0
IH & IL
0.8
0.6 IGT
0.4
0.2
Tj(°C)
0.0
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130
Figure 10. Relative variation of holding
current versus gate-cathode
resistance (typical values)
IH[RGK] / IH[RGK=1k]
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
1.E-02
1.E-01
RGK(k)
1.E+00
1.E+01
1.E+02
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X006 Series
Characteristics
Figure 11. Relative variation of dV/dt immunity Figure 12. Relative variation of dV/dt immunity
versus gate-cathode resistance
versus gate-cathode capacitance
(typical values)
(typical values)
dV/dt[RGK] / dV/dt[RGK=1k]
100.0
VD = 0.67 x VDRM
dV/dt[CGK] / dV/dt[RGK=1k]
100
VD = 0.67 x VDRM
RGK = 1k
10.0
1.0
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0.1
1.0E-01
RGK(k)
1.0E+00
10
1.0E+01
1
1
CGK(nF)
10
Figure 13.
Surge peak on-state current versus Figure 14.
number of cycles
Non repetitive surge peak on-state
current for a sinusoidal pulse with
width tP<10ms, and corresponding
value of I2t
ITSM(A)
10
9
8
7
6
5
4 Repetitive
TC=25°C
3
2
1
0
1
Non repetitive
Tj initial=25°C
Number of cycles
10 100
tp=10ms
One cycle
1000
ITSM(A), I2t (A2s)
1.E+02
1.E+01
ITSM
Tj initial = 25°C
1.E+00
1.E-01
0.01
tp(ms)
0.10
I2t
1.00
10.00
Figure 15. On-state characteristics (maximum
values)
ITM(A)
10.00
Tj max.:
Vt0=0.85V
Rd=245m
1.00
Tj=125°C
0.10
Tj=25°C
VTM(V)
0.01
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
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Ordering information scheme
2
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Ordering information scheme
X 006 0Y M ZBlank 1AA2
Sensitive SCR series
Current
006 = 0.8 A
Sensitivity
02 = 200 µA
05 = 60 µA
Voltage
M = 600 V
Package
A = TO-92 (A"Blank")
N = SOT-223 (N"No Blank”)
Packing mode
1AA2 = Bulk
2AL2 = Ammopack
5AL2 = Tape & reel (TO-92)
5BA4 = Tape & reel (SOT-223)
X006 Series
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X006 Series
3 Package information
Package information
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Table 4. TO-92 (plastic) dimensions
DIMENSIONS
REF.
Millimeters
Inches
BC
A
F
D
E
Min. Typ. Max. Min. Typ. Max.
aA
B
1.35
4.70
0.053
0.185
C 2.54
0.100
D 4.40
0.173
E 12.70
0.500
F 3.70 0.146
a 0.50 0.019
Table 5. SOT-223 dimensions in mm
DIMENSIONS
REF.
Millimeters
Inches
A
A1
V
B
e1
D
B1
HE
4
123
e
c Min. Typ. Max. Min. Typ. Max.
A 1.80 0.071
A1 0.02
0.001
B 0.60 0.70 0.80 0.024 0.027 0.031
B1 2.90 3.00 3.10 0.114 0.118 0.122
c 0.24 0.26 0.32 0.009 0.010 0.013
D 6.30 6.50 6.70 0.248 0.256 0.264
e 2.3
0.090
e1 4.6
0.181
E 3.30 3.50 3.70 0.130 0.138 0.146
H 6.70 7.00 7.30 0.264 0.276 0.287
V 10° max
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Package information
Figure 16. SOT-223 footprint (dimensions in mm)t
3.25
1.32
X006 Series
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5.16
7.80
2.30
1.32
0.95
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
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X006 Series
4 Ordering information
Ordering information
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Ordering type
Voltage Sensitivity Marking Package Weight Base qty
Delivery
mode
X00602MA 1AA2
X00602MA 2AL2
X00602MA 5AL2
X00602MN5BA4
X00605MA 1AA2
600 V
X0602 MA TO-92 0.2 g
200 µA
60 µA
X06 2M SOT-223 0.12 g
X0605 MA TO-92 0.2 g
2500
2000
2000
1000
2500
Bulk
Ammopack
Tape & reel
Bulk
5 Revision history
Date
Jan-2002
08-Aug-2006
Revision
3 Last update.
4 SOT-223 package added.
Changes
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X006 Series
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