Fairchild Semiconductor Electronic Components Datasheet



FPF2148

Full Function Load Switch


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FPF2148
Full Function Load Switch
Features
„ 1.8 to 5.5V Input Voltage Range
„ Controlled Turn-On
„ 200mA Current Limit Options
„ Undervoltage Lockout
„ Thermal Shutdown
„ <2µA Shutdown Current
„ Fast Current limit Response Time
„ 5µs to Moderate Over Currents
„ 30ns to Hard Shorts
„ Fault Blanking
„ Power Good Function
„ RoHS Compliant
Applications
„ PDAs
„ Cell Phones
„ GPS Devices
„ MP3 Players
„ Digital Cameras
„ Peripheral Ports
„ Hot Swap Supplies
November 2008
tm
General Description
The FPF2148 is a load switch which provides full protection to
systems and loads which may encounter large current
conditions. These devices contain a 0.12current-limited
P-channel MOSFET which can operate over an input voltage
range of 1.8-5.5V. Switch control is by a logic input (ONB)
capable of interfacing directly with low voltage control signals.
The part contains thermal shutdown protection which shuts off
the switch to prevent damage to the part when a continuous
over-current condition causes excessive heating.
When the switch current reaches the current limit, the part
operates in a constant-current mode to prohibit excessive
currents from causing damage. For the FPF2148, a current limit
condition will immediately pull the fault signal pin low and the
part will remain in the constant-current mode until the switch
current falls below the current limit. The minimum current limit is
200mA.
The part is available in a space-saving 6 pin 2X2 MLP package.
BOTTOM
Pin 1
TOP
Ordering Information
Part
FPF2148
Current Limit
[mA]
200/300/400
Current Limit
Blanking Time
[ms]
0
Auto-Restart
Time
[ms]
NA
ONB Pin
Activity
Active LO
©2008 Fairchild Semiconductor Corporation
FPF2148 Rev. H
1
www.fairchildsemi.com


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Typical Application Circuit
ON OFF
VIN VOUT
FPF2148
PGOOD
FLAGB
ONB
GND
TO LOAD
Functional Block Diagram
VIN
UVLO
ONB
THERMAL
SHUTDOWN
CONTROL
LOGIC
FLAGB
CURRENT
LIMIT
REVERSE
CURRENT
BLOCKING
VOUT
PGOOD
GND
FPF2148 Rev. H
2 www.fairchildsemi.com


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Pin Configuration
ONB 6
1 PGOOD
GND 5 7 2 VIN
FLAGB 4
3 VOUT
2X2 MicroFET-6
Pin Description
Pin Name
1 PGOOD
2 VIN
3 VOUT
4 FLAGB
5, 7 GND
6 ONB
Function
Power Good output: Open drain output which indicate that output voltage has reached
90% of input voltage
Supply Input: Input to the power switch and the supply voltage For the IC
Switch Output: Output of the power switch
Fault Output: Active LO, open drain output which indicates an over current supply under
voltage or over temperature state.
Ground
ON Control Input
Absolute Maximum Ratings
Parameter
VIN, VOUT, ONB, FLAGB, PGOOD to GND
Power Dissipation
Operating and Storage Junction Temperature
Thermal Resistance, Junction to Ambient
Jedec A114A
Jedec C101C
Electrostatic Discharge Protection
Jedec A115
IEC 61000-4-2
HBM
CDM
MM
Air Discharge
Contact Discharge
Min
-0.3
-65
4000
2000
400
15000
8000
Max
6
1.2
150
86
Unit
V
W
°C
°C/W
V
V
V
V
V
Recommended Operating Range
Parameter
VIN
Ambient Operating Temperature, TA
Min
Max
Unit
1.8 5.5
V
-40 85 °C
Electrical Characteristics
VIN = 1.8 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25°C.
Parameter
Symbol
Conditions
Min
Basic Operation
Operating Voltage
Quiescent Current
VIN
IQ IOUT = 0mA
VIN = 1.8V
VIN = 3.3V
VIN = 5.5V
1.8
40
Typ
70
75
85
Max Units
5.5 V
100
µA
120
FPF2148 Rev. H
3 www.fairchildsemi.com


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Electrical Characteristics Cont.
.VIN = 1.8 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25°C
Parameter
Symbol
Conditions
Min Typ
On-Resistance
ONB Input Logic High Voltage (ON)
ONB Input Logic Low Voltage
ONB Input Leakage
VIN Shutdown Current
FLAGB Output Logic Low Voltage
FLAGB Output High Leakage
Current
RON
VIH
VIL
VIN = 3.3V, IOUT = 200mA, TA = 25°C
VIN = 3.3V, IOUT = 200mA, TA = 85°C
VIN = 3.3V, IOUT = 200mA, TA = -40°C to +85°C
VIN = 1.8V
VIN = 5.5V
VIN = 1.8V
VIN = 5.5V
VONB = VIN or GND
VONB = 5.5V, VOUT = 5.5V,
VIN = short to GND
VIN = 5V, ISINK = 10mA
VIN = 1.8V, ISINK = 10mA
VIN = 5V, VONB = 0V
65
0.8
1.4
-1
-2
120
135
0.05
0.12
PGOOD Threshold Voltage
PGOOD Threshold Voltage
Hysteresis
VIN = 5.5V
90
1
PGOOD Output Logic Low Voltage
PGOOD Output High Leakage
Current
VIN = 5V, ISINK = 10mA
VIN = 1.8V, ISINK = 10mA
VIN = 5V, VONB = 0V
0.05
0.12
Reverse Block
VOUT Shutdown Current
Protections
VONB = 5.5V, VOUT = 5.5V,
VIN = short to GND
-2
Current Limit
Thermal Shutdown
ILIM VIN = 3.3V, VOUT = 3.0V
Shutdown Threshold TJ increasing
Return from Shutdown
200 300
140
130
Hysteresis
10
Under Voltage Lockout
Under Voltage Lockout Hysteresis
VUVLO VIN Increasing
1.55 1.65
50
Dynamic
Delay On Time
Delay Off Time
VOUT Rise Time
VOUT Fall Time
Short Circuit Response Time
tdON
tdOFF
tR
tF
RL = 500, CL = 0.1µF
RL = 500, CL = 0.1µF
RL = 500, CL = 0.1µF
RL = 500, CL = 0.1µF
VIN = 5.5V, VONB = GND. Moderate
Over-Current Condition
VIN = 5.5V, VONB = GND. Hard Short
25
45
10
110
5
30
Max Units
160
180 m
180
V
0.5
V
1
1 µA
2 µA
0.2
V
0.3
1 µA
%
%
0.1 V
0.2 V
1 µA
2 µA
400 mA
°C
1.75 V
mV
µs
µs
µs
µs
µs
ns
Note 1: Package power dissipation on 1square inch pad, 2 oz. copper board.
FPF2148 Rev. H
4 www.fairchildsemi.com


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Typical Characteristics
90
85
80
75
70
65
60
1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
SUPPLY VOLTAGE (V)
Figure 1. Quiescent Current vs. Input Voltage
110
105
100
95
90
85
80
75
70
65
60
55
50
-40
VIN = 5.5V
VIN = 3.3V
VIN = 1.8V
-15 10 35 60
TJ, JUNCTION TEMPERATURE (°C)
85
Figure 2. Quiescent Current vs. Temperature
1.3
1.2
1.1
1
0.9
0.8
0.7
0.6
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
SUPPLY VOLTAGE (V)
1.2
1.1
1
0.9
0.8
0.7
0.6
0.5
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
SUPPLY VOLTAGE (V)
Figure 3. VONB High Voltage vs. Input Voltage
Figure 4. VONB Low Voltage vs. Input Voltage
200
190
180
170
160
150
140
130
120
110
100
90
80
1
234
VIN, SUPPLY VOLTAGE (V)
Figure 5. RON vs. VIN
5
240
220
200
180
160
140
120
100
80
60
6 -40
VIN= 1.8V
VIN= 3.3V
VIN= 5.5V
-15 10 35 60
TJ, JUNCTION TEMPERATURE (°C)
Figure 6. RON vs. Temperature
85
FPF2148 Rev. H
5 www.fairchildsemi.com


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Typical Characteristics
350
VIN = 5.5V
300
250
200
150
100
50
0
0123456
VIN - VOUT (V)
Figure 7. Current Limit vs. Output Voltage
320
315
310
305
300
295
290
-65 -40 -15 10 35 60 85 110 135
TJ, JUNCTION TEMPERATURE (°C)
Figure 8. Current Limit vs. Temperature
100
VIN = 3.3 V
RL = 500 Ohms
COUT = 0.1uF
tdOFF
tdON
1000
VIN = 3.3 V
RL = 500 Ohms
100
10
TF
TR
10
-40
-15 10 35 60
TJ, JUNCTION TEMPERATURE (°C)
Figure 9. tdON / tdOFF vs. Temperature
85
1
-40
-15 10 35 60
TJ, JUNCTION TEMPERATURE (°C)
Figure 10. TRISE / TFALL vs. Temperature
85
VONB
2V/DIV
IOUT
10mA/DIV
CIN = 10µF
COUT = 0.1µF
RL = 500
VIN = 3.3V
VOUT
2V/DIV
100µs/DIV
Figure 11. tdON Response
VONB
2V/DIV
IOUT
10mA/DIV
CIN = 10µF
COUT = 0.1µF
RL = 500
VIN = 3.3V
1µs/DIV
Figure 12. tdOFF Response
FPF2148 Rev. H
6 www.fairchildsemi.com


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Typical Characteristics
VIN
2V/DIV
IOUT
5A/DIV
VOUT
2V/DIV
CIN = 10µF
VIN = 3.3V
50µs/DIV
Figure 13. Short Circuit Response Time
(Output shorted to GND)
VIN
2V/DIV
VONB
2V/DIV
IOUT
200mA/DIV
VOUT
2V/DIV
CIN = 10µF
VOUT = VONB = GND
50µs/DIV
Figure 14. Current Limit Response Time
(Switch is powered into a short)
VIN
2V/DIV
VONB
2V/DIV
IOUT
200mA/DIV
CIN = 10µF
VIN = 3.3V
VOUT
2V/DIV
50µs/DIV
Figure 15. Current Limit Response Time
(Output is loaded by 2.2, COUT = 0.1µF)
VIN
2V/DIV
VONB
2V/DIV
CIN = 10µF
VIN = 3.3V
IOUT
200mA/DIV
VOUT
2V/DIV
50µs/DIV
Figure 16. Current Limit Response Time
(Output is loaded by 2.2, COUT = 10µF)
VIN
5V/DIV
VONB
5V/DIV
CIN = 10µF
COUT = 0.1µF
RL = 500
VIN = 5.5V
VOUT
5V/DIV
PGOOD
5V/DIV
10µs/DIV
Figure 17. PGOOD Response
FPF2148 Rev. H
7 www.fairchildsemi.com


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Description of Operation
The FPF2148 is a current limited switch that protects systems
and loads which can be damaged or disrupted by the
application of high currents. The core of each device is a 0.12
P-channel MOSFET and a controller capable of functioning over
a wide input operating range of 1.8-5.5V. The controller protects
against system malfunctions through current limiting,
undervoltage lockout and thermal shutdown and power good
features. The current limit is preset for 200mA.
On/Off Control
The ONB pin controls the state of the switch. Activating ONB
continuously (ONB pin low) holds the switch in the on state so
long as there is no undervoltage on VIN or a junction
temperature in excess of 140°C. ONB is active LO and has a
low threshold making it capable of interfacing with low voltage
signals. In addition, excessive currents will cause the switch to
turn off due to thermal shutdown. The FPF2148 does not turn
off in response to a over current condition but instead remain
operating in a constant current mode so long as ONB is active
and the thermal shutdown or undervoltage lockout have not
activated.
The ON pin control voltage and VIN pin have independent
recommended operating ranges. The ON pin voltage can be
driven by a voltage level higher than the input voltage.
Fault Reporting
Upon the detection of an over-current, an input undervoltage, or
an over-temperature condition, the FLAGB signals the fault
mode by activating LO. And the FLAGB goes LO immediately. It
will remain LO during the faults and immediately returns HI at
the end of the fault condition. FLAGB is an open-drain output
which requires a pull-up resistor between VIN and FLAGB.
During shutdown, the pull-down on FLAGB is disabled to reduce
current draw from the supply.
Current Limiting
The current limit ensures that the current through the switch
doesn't exceed 400mA while not limiting at less than 200mA.
The FPF2148 have no current limit blanking period so
immediately upon a current limit condition FLAGB is activated.
The part will remain in a constant current state until the ONB pin
is deactivated or the thermal shutdown turns-off the switch.
Thermal Shutdown
The thermal shutdown protects the die from internally or
externally generated excessive temperatures. During an over-
temperature condition the FLAGB is activated and the switch is
turned-off. The switch automatically turns-on again if
temperature of the die drops below the threshold temperature.
Power Good
FPF2148 has a "Power Good" feature. PGOOD pin is an
open-drain MOSFET which asserts high when the output
voltage reaches 90% of the input voltage.
PGOOD pin requires an external pull up resistor that is con-
nected to the output voltage when there is no battery in the load
side and the logic level of the subsequent controller permits.
This would give logic levels similar to a CMOS output stage for
PGOOD, while still keeping the option to tie the pull-up to a dif-
ferent supply voltage. A 100Kis recommended to be used as
pull up resistor. The PGOOD pin status is independent of the
ONB pin position. This mean that PGOOD pin stays low when
the load switch is OFF. If the Power Good feature is not used in
the application the pin can be connected directly to GND.
Timing Diagram
VON
10%
90%
VOUT
90%
10%
where:
tdON =
tR =
tON =
tdOFF =
tF =
tOFF =
tdON tR
tON
Delay On Time
VOUT Rise Time
Turn On Time
Delay Off Time
VOUT Fall Time
Turn Off Time
90%
10%
tdOFF tF
tOFF
Undervoltage Lockout
The undervoltage lockout turns-off the switch if the input voltage
drops below the undervoltage lockout threshold. With the ONB
pin active the input voltage rising above the undervoltage
lockout threshold will cause a controlled turn-on of the switch
which limits current over-shoots.
FPF2148 Rev. H
8 www.fairchildsemi.com


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Application Information
Typical Application
Battery
1.8V-5.5V
Typical value = 100K
ON OFF
C1 = 4.7µF
VIN VOUT
FPF2148
PGOOD
ONB
GND
FLAGB
LOAD
R1 = 100K
C2 = 0.1µF
R2 = 499
Input Capacitor
To limit the voltage drop on the input supply caused by transient
in-rush currents when the switch turns-on into a discharged load
capacitor or a short-circuit, a capacitor needs to be placed
between VIN and GND. A 4.7µF ceramic capacitor, CIN, must be
placed close to the VIN pin. A higher value of CIN can be used to
further reduce the voltage drop experienced as the switch is
turned on into a large capacitive load.
Output Capacitor
A 0.1µF capacitor COUT, should be placed between VOUT and
GND. This capacitor will prevent parasitic board inductances
from forcing VOUT below GND when the switch turns-off. For the
FPF2148, the total output capacitance needs to be kept below a
maximum value, COUT(max), to prevent the part from
registering an over-current condition and turning-off the switch.
The maximum output capacitance can be determined from the
following formula,
COUT(max) =
ILIM(max) x tR(max)
VIN
(1)
Board Layout
For best performance, all traces should be as short as possible.
To be most effective, the input and output capacitors should be
placed close to the device to minimize the effects that parasitic
trace inductances may have on normal and short-circuit
operation. Using wide traces for VIN, VOUT and GND will help
minimize parasitic electrical effects along with minimizing the
case to ambient thermal impedance.
The middle pad (pin 7) should be connected to the GND plate
of PCB for improving thermal performance of the load switch.
An improper layout could result higher junction temperature and
triggering the thermal shutdown protection feature. This concern
applies when the switch is in an overcurrent condition or the
worst case when output is shorted to ground.
Power Dissipation
During normal operation as a switch, the power dissipation is
small and has little effect on the operating temperature of the
part. The parts with the higher current limits will dissipate the
most power and that will only be,
P = (ILIM)2 x RDS = (0.4)2 x 0.12 = 19.2mW
(2)
If the part goes into current limit the maximum power dissipation
will occur when the output is shorted to ground. For the
FPF2148, a short on the output will cause the part to operate in
a constant current state dissipating a worst case power as
calculated in (3) until the thermal shutdown activates. It will then
cycle in and out of thermal shutdown so long as the ONB pin is
active and the short is present.
P(max) = VIN(max) x ILIM(max)
(3)
= 5.5 x 0.4 = 275mW
FPF2148 Rev. H
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Application Notes
Startup Power Sequence
VIN1 FPF2148 VOUT1
VIN1
ON OFF
PGOOD
ONB
GND
FLAGB
100K
VIN2 Any Active HI VOUT2
Load Switch
VIN2
FLAGB
ON GND
To Load
To Load
Power good function in sequential startup. No battery is loaded to the output
Sequential Startup using Power Good
The power good pin can be connected to another active high
load switch’s enable pin to implement sequential startup.
PGOOD pin asserts low when the load switch is OFF. This
feature allows driving a subsequent circuit. The diagram above
illustrates power good function in sequential startup. As the
VOUT1 of the FPF2148 starts to ramp to the 90% of its input
voltage the active high switch remains in OFF state. Whereas
the VOUT1 passes the 90% threshold, power good signal
becomes active and asserts high. This signal will turn on the
active high load switch and VOUT2 will start to increase. The
total startup time may vary according to the difference between
supply voltages that are used in the application.
FPF2148 Rev. H
10 www.fairchildsemi.com


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Dimensional Outline and Pad Layout
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Rev. I37
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