Fairchild Semiconductor Electronic Components Datasheet



FPF2194

Full-Function Load Switch


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September 2014
FPF2193 / FPF2194 / FPF2195
Full-Function Load Switch with Adjustable Current Limit
Features
<1.8 to 5.5 V Input Voltage Range
Controlled Turn-On
0.1 to 1.5 A Adjustable Current Limit
Under-Voltage Lockout
Thermal Shutdown
<2 µA Shutdown Current
Auto Restart
Fast Current Limit Response Time
5 µs to Moderate Over Currents
30 ns to Hard Shorts
Fault Blanking
Reverse Current Blocking
Applications
PDAs
Cell Phones
Handheld GPS Devices
Portable Enterprise / Industrial Devices
Digital Cameras
Peripheral Ports and Accessories
Portable Medical Equipment
Hot Swap Supplies
Description
The FPF2193, FPF2194, and FPF2195 form a series of
load switches that provides full protection to systems
and loads that may encounter large current conditions.
These devices contain a 55 mcurrent-limited P-
channel MOSFET that can operate over an input
voltage range of 1.8 to 5.5 V. Internally, current is
prevented from flowing when the MOSFET is off and the
output voltage is higher than the input voltage. Switch
control is by a logic input (ON) capable of interfacing
directly with low-voltage control signals. Each part
contains thermal shutdown protection that shuts off the
switch to prevent damage to the part when a continuous
over-current condition causes excessive heating.
When the switch current reaches the current limit, the
parts operate in a constant-current mode to prohibit
excessive currents from causing damage. For the
FPF2193 and FPF2194, if the constant current condition
still persists after 30 ms, the parts shut off the switch
and pull the fault signal pin (FLAGB) LOW. The
FPF2193 has an auto-restart feature that turns the
switch on again after 450 ms if the ON pin is still active.
The FPF2194 does not have this auto-restart feature, so
the switch remains off until the ON pin is cycled. The
FPF2195 does not turn off after a current limit fault, but
remains in the constant-current mode indefinitely. The
minimum current limit can be set as low as 45 mA.
These parts are available in a space-saving six ball
advanced 0.98 x 1.48 mm WLCSP package.
Ordering Information
Part Number
Current
Limit [mA]
FPF2193
FPF2194
100-1500
FPF2195
FPF2195BUCX 45-1500
Current Limit Blanking
Time [ms]
15/30/60
15/30/60
0
0
Auto-Restart
Time [ms]
225/450/900
NA
NA
NA
ON Pin
Activity
Active HIGH
Top Mark
S6
S7
S9
SY
© 2009 Fairchild Semiconductor Corporation
FPF2193/4/5 • Rev. 1.0.9
www.fairchildsemi.com


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Application Diagram
Block Diagram
Figure 1. Typical Application
Figure 2. Functional Block Diagram
© 2009 Fairchild Semiconductor Corporation
FPF2193/4/5 • Rev. 1.0.9
2
www.fairchildsemi.com


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Pin Configuration
Figure 3. 1.0 x 1.5 mm Chip-Scale Package
Figure 4. Pin Configuration (Bottom View)
Pin Definitions
Pin #
C1
B2
B1
A1
C2
A2
Name
ISET
VIN
VOUT
FLAGB
GND
ON
Description
Current Limit Set Input. A resistor from ISET to ground sets the current limit for the switch.
Supply Input. Input to the power switch and the supply voltage for the IC.
Switch Output. Output of the power switch.
Fault Output. Active LOW, open-drain output that indicates an over-current supply, under-
voltage, or over-temperature state.
Ground.
ON control input, active HIGH.
© 2009 Fairchild Semiconductor Corporation
FPF2193/4/5 • Rev. 1.0.9
3
www.fairchildsemi.com


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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
VIN, VOUT, ON, FLAGB, ISET to GND
PD Power Dissipation at TA = 25°C(1)
TJ Operating Temperature Range
TSTG
ΘJA
ESD
Storage Temperature
Thermal Resistance, Junction to Ambient
Electrostatic Discharge Capability
Human Body Model, JESD22-A114
Machine Model, JESD22-A115
Note:
1. Package power dissipation on one-square inch pad, two-ounce copper board.
Min.
-0.3
-40
-65
8000
400
Max.
6.0
1.2
+125
+150
85
Unit
V
W
°C
°C
°C/W
V
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to Absolute Maximum Ratings.
Symbol
Parameter
VIN Input Voltage
TA Ambient Operating Temperature
Min.
1.8
-40
Max.
5.5
+85
Unit
V
°C
© 2009 Fairchild Semiconductor Corporation
FPF2193/4/5 • Rev. 1.0.9
4
www.fairchildsemi.com


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Electrical Characteristics
VIN = 1.8 to 5.5 V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3 V and TA = 25°C.
Symbol
Parameter
Conditions
Min. Typ. Max. Units
Basic Operation
VIN Operating Voltage
IQ Quiescent Current
RON On Resistance
VIH
On Input Logic High Voltage
ON
VIL On Input Logic Low Voltage
IIN On Input Leakage
VIN_SD VIN Shutdown Current
VFLB_L
FLAGB Output Logic Low
Voltage
IFLB_H
FLAGB Output Logic High
Leakage Current
Reverse Block
ISDT VOUT Shutdown Current
Vbreakdown Reverse Breakdown Voltage
Protections
Current Limit
ILIM Current Limit for
FPF2195BUCX
ILIM(MIN) Minimum Current Limit
TSD Thermal Shutdown
VUVLO Under-Voltage Lockout
VUVLO_HYST
Under-Voltage Lockout
Hysteresis
Dynamic
tdON
tR
tON
tdOFF
tF
tOFF
tBLANK
tRSTRT
Delay On Time
VOUT Rise Time
Turn-On Time
Delay Off Time
VOUT Fall Time
Turn-Off Time
Over-Current Blanking Time
Auto-Restart
tSC Short-Circuit Response Time
VIN=1.8 V
IOUT=0 mA, VON=VIN VIN=3.3 V
VIN=5.5 V
TA=25°C, IOUT=200 mA
TA=-40 to 85°C, IOUT=200 mA
VIN=1.8 V
VIN=5.5 V
VIN=1.8 V
VIN=5.5 V
VON=VIN or GND
VON=0 V, VIN=5.5 V,
VOUT=Short to GND
VIN=5 V, ISINK=10 mA
VIN=1.8 V, ISINK=10 mA
VIN=5 V, Switch ON
VON=0 V, VOUT=5.5 V,
VIN=Short-to-GND
VIN=VON=0 V, IOUT=200 µA
VIN=3.3 V, VOUT=3.0 V, RSET=690 Ω
VIN=4.5 V, VOUT=4.2 V,
RSET=15.8 KΩ
VIN=3.3 V, VOUT=3.0 V,
RSET=5516 Ω
Shutdown Threshold
Return from Shutdown
Hysteresis
VIN Increasing
RL=500 Ω, CL=0.1 µF
RL=500 Ω, CL=0.1 µF
RL=500 Ω, CL=0.1 µF
RL=500 Ω, CL=0.1 µF
RL=500 Ω, CL=0.1 µF
RL=500 Ω, CL=0.1 µF
FPF2193, FPF2194
FPF2193 Only
VIN=VOUT=3.3 V, Moderate Over-
Current Condition
VIN=VOUT=3.3 V, Hard Short
1.8
0.8
1.4
-1
-2
-2
600
35
1.55
15
225
70
75
80
55
0
0.05
0.12
9
800
45
100
140
130
10
1.65
50
20
20
40
15
110
125
30
450
5
30
5.5
80
135
0.5
1.0
1
2
0.20
0.30
1
2
1000
60
1.75
60
900
V
µA
mΩ
V
V
µA
µA
V
µA
µA
V
mA
mA
ma
°C
V
mV
µs
µs
µs
µs
µs
µs
ms
ms
µs
ns
© 2009 Fairchild Semiconductor Corporation
FPF2193/4/5 • Rev. 1.0.9
5
www.fairchildsemi.com


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Typical Performance Characteristics
Figure 5. Quiescent Current vs. Input Voltage
Figure 6. Quiescent Current vs. Input Voltage
Figure 7. Quiescent Current vs. Temperature
Figure 8. VON High Voltage vs. Input Voltage
Figure 9. VON Low Voltage vs. Input Voltage
Figure 10. Current Limit vs. Output Voltage
© 2009 Fairchild Semiconductor Corporation
FPF2193/4/5 • Rev. 1.0.9
6
www.fairchildsemi.com


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Typical Performance Characteristics (Continued)
Figure 11. Current Limit vs. Temperature
Figure 12. RON vs. VIN
Figure 13. RON vs. Temperature
Figure 14. tON / tOFF vs. Temperature
Figure 15. tRISE / tFALL vs. Temperature
Figure 16. tRSTRT vs. Temperature
© 2009 Fairchild Semiconductor Corporation
FPF2193/4/5 • Rev. 1.0.9
7
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Typical Performance Characteristics (Continued)
Figure 17. tBLANK vs.Temperature
Figure 18. tON Response
Figure 19. tOFF Response
Figure 20. Short-Circuit Response Time
(Output Shorted to GND)
Figure 21. Current Limit Response Time
(Switch is Powered into a Short)
Figure 22. Current Limit Response Time
(Output is Loaded by 2.2 Ω, COUT=0.1 µF)
© 2009 Fairchild Semiconductor Corporation
FPF2193/4/5 • Rev. 1.0.9
8
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Typical Performance Characteristics (Continued)
Figure 23. Current Limit Response Time
(Output is Loaded by 2.2 Ω, COUT=10 µF)
Figure 24. Short-Circuit Detection Function(2)
Figure 25. tBLANK vs. Response(3)
Figure 26. tRESTART vs. Response(3)
Notes:
2. When the output voltage is below VSCTH=1.1 V, the current limit value is set at 62.5% of the current limit value.
3. VDRV signal forces the device to go into over-current condition by loading.
© 2009 Fairchild Semiconductor Corporation
FPF2193/4/5 • Rev. 1.0.9
9
www.fairchildsemi.com


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Functional Description
The FPF2193, FPF2194, and FPF2195 are current-
limited switches that protect systems and loads that can
be damaged or disrupted by the application of high
currents. The core of each device is a 55 mP-channel
MOSFET and a controller capable of functioning over the
wide input operating range of 1.8- 5.5 V. The controller
protects against system malfunctions through current
limiting, under-voltage lockout, and thermal shutdown.
The current limit is adjustable from 100 mA (45 mA for
FPF2195BUCX) to 1.5 A through the selection of an
external resistor.
On/Off Control
The ON pin controls the state of the switch. When ON is
HIGH, the switch is in ON state. Activating ON
continuously holds the switch in the ON state so long as
there is no fault. For all versions, an under-voltage on VIN
or a junction temperature in excess of 140°C overrides
the ON control to turn off the switch. In addition,
excessive currents cause the switch to turn off in the
FPF2193 and FPF2194. The FPF2193 has an auto-
restart feature that automatically turns the switch on again
after 450 ms. For the FPF2194, the ON pin must be
toggled to turn the switch on again. The FPF2195 does
not turn off in response to an over-current condition, but
remains operating in constant-current mode as long as
ON is active and the thermal shutdown or under-voltage
lockout have not activated.
Fault Reporting
Upon the detection of an over-current, input under-
voltage, or over-temperature condition, FLAGB signals
the fault mode by activating LOW. For the FPF2193 and
FPF2194, the FLAGB goes LOW at the end of the
blanking time, while FLAGB goes LOW immediately for
the FPF2195. FLAGB remains LOW through the auto-
restart time for the FPF2195. For the FPF2194, FLAGB is
latched LOW and ON must be toggled to release it. With
the FPF2195, FLAGB is LOW during the faults and
immediately returns HIGH at the end of the fault
condition. FLAGB is an open-drain MOSFET that requires
a pull-up resistor between VIN and FLAGB. During
shutdown, the pull-down on FLAGB is disabled to reduce
current draw from the supply.
Current Limiting
The current limit ensures that the current through the
switch doesn't exceed a maximum value, while not
limiting at less than a minimum value. The current at
which the parts limit is adjustable through the selection of
an external resistor connected to ISET. Information for
selecting the resistor is found in the Application
Information section. The FPF2193 and FPF2194 have a
blanking time of 30 ms, nominally, during which the
switch acts as a constant current source. At the end of
the blanking time, the switch is turned off. The FPF2195
has no current limit blanking period, so it remains in a
constant current state until the ON pin is deactivated or
the thermal shutdown turns off the switch.
For preventing the switch from large power dissipation
during heavy load, a short-circuit detection feature is
introduced. Short-circuit condition is detected by,
observing the output voltage. The switch is put into short-
circuit current-limiting mode if the switch is loaded with a
heavy load. When the output voltage drops below VSCTH,
the short-circuit detection threshold voltage, the current
limit value is re-conditioned and the short-circuit current-
limit value is decreased to 62.5% of the current limit
value. This keeps the power dissipation of the part below
a certain limit even at dead-short conditions at 5.5 V input
voltage. The VSCTH value is set to be 1 V. At around 1.1 V
of output voltage, the switch is removed from short-circuit
current-limiting mode and the current limit is set to the
current limit value.
Under-Voltage Lockout (UVLO)
The under-voltage lockout turns the switch off if the input
voltage drops below the under-voltage lockout threshold.
With the ON pin active, the input voltage rising above the
under-voltage lockout threshold causes a controlled turn-
on of the switch, which limits current over shoot.
Thermal Shutdown
The thermal shutdown protects the die from internally or
externally generated excessive temperatures. During an
over-temperature condition, FLAGB is activated and the
switch is turned off. The switch automatically turns on
again if temperature of the die drops below the
threshold temperature.
Reverse-Current Blocking
The entire FPF2193/94/95 family has a reverse current
blocking feature that protects the input source against
current flow from output to input. For a standard USB
power design, this is an important feature to protect the
USB host from being damaged due to reverse current
flow on VBUS.
When the load switch is OFF, no current flows from the
output to the input. If the switch is turned on and the
output voltage is greater than input voltage, this feature is
activated and turns off the switch. This prevents any
current flow from output to input. The reverse-current
blocking feature is deactivated if the VOUT - VIN is smaller
than a typically 50 mV threshold. During this time, some
current (50 mV/RON) flows from the output to input until
input voltage becomes greater than output voltage.
FLAGB operation is independent of the reverse-current
blocking and does not report a fault condition if this
feature is activated.
Figure 27.
where:
tdON = Delay On Time
tR = VOUT Rise Time
tON = Turn-On Time
tdOFF = Delay Off Time
tF = VOUT Fall Time
tOFF = Turn-Off Time
Timing Diagram
© 2009 Fairchild Semiconductor Corporation
FPF2193/4/5 • Rev. 1.0.9
10
www.fairchildsemi.com


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Application Information
Figure 28. Typical Application
Setting Current Limit
The FPF2193, FPF2194, and FPF2195 current limit is
set with an external resistor connected between ISET and
GND. This resistor is selected using the following
equation:
RSET
=
551.6
ILIM
RSET is in Ω and ISET is in Amps.
(1)
Table 1 can also be used to select RSET. A typical
application would be the 500 mA current required by a
single USB port. Using Table 1, an appropriate selection
for the RSET resistor would be 788 . This ensures that
the port load could draw 525 mA, but not more than
875 mA. Likewise for a dual-port system; an RSET of
368 always delivers at least 1125 mA and never more
than 1875 mA.
Table 1. Current Limit Various RSET Values
RSET(Ω)
Min. Current
Limit (mA)
368 1125
441 928
552 750
613 675
690 600
788 525
919 450
1103
375
1226
338
1379
300
1576
263
1839
225
2206
188
2758
150
3677
113
5516
15800(4)
75
35
Typ. Current
Limit (mA)
1500
1250
1000
900
800
700
600
500
450
400
350
300
250
200
150
100
45
Max. Current
Limit (mA)
1875
1562
1250
1125
1000
875
750
625
563
500
438
375
313
250
188
125
60
Input Capacitor
To limit the voltage drop on the input supply caused by
transient inrush currents when the switch is turned on
into a discharged load capacitor or a short-circuit, a
capacitor needs to be placed between VIN and GND. A
0.1 µF ceramic capacitor, CIN, placed close to the pins is
usually sufficient. Higher values of CIN can be used to
further reduce the voltage drop.
Output Capacitor
A 0.1 µF capacitor, COUT, should be placed between
VOUT and GND. This capacitor prevents parasitic board
inductances from forcing VOUT below GND when the
switch turns off. For the FPF2193 and FPF2194, the
total output capacitance needs to be kept below a
maximum value, COUT(max), to prevent the part from
registering an over-current condition and turning off the
switch. The maximum output capacitance can be
determined from the following formula:
COUT(max)
=
ILIM(max)× tBLANK(min)
VIN
(2)
Power Dissipation
During normal operation as a switch, the power
dissipated depends upon the level at which the current
limit is set. The maximum allowed setting for the current
limit is 1.5 A and results in a power dissipation of:
P = (ILIM)2 ×RON = (1.5)2 × 0.055 = 123.75mW (3)
If the part goes into current limit, the maximum power
dissipation occurs when the output is shorted to ground.
For the FPF2193, the power dissipation scales by the
auto-restart time, tRSTRT, and the over-current blanking
time, tBLANK, so that the maximum power dissipated is:
P(max) =
tBLANK
tBLANK + tRSTRT
× VIN(max)×ILIM(max)
=
30
30 + 450
× 5.5 ×1.5
=
515.6mW
(4)
Note:
4. FPF2195BUCX only.
© 2009 Fairchild Semiconductor Corporation
FPF2193/4/5 • Rev. 1.0.9
11
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This is more power than the package can dissipate, but
the thermal shutdown of the part activates to protect the
part from damage due to excessive heating. When
using the FPF2194, attention must be given to the
manual resetting of the part. The junction temperature is
only able to increase to the thermal shutdown threshold.
Once this temperature has been reached, toggling ON
does not turn the switch on until the junction
temperature drops. For the FPF2195, a short on the
output causes the part to operate in a constant-current
state, dissipating a worst-case power of:
P(max) = VIN(max)×ILIM(max)
= 5.5 ×1.5 = 8.25W
(5)
This large amount of power activates the thermal
shutdown and the part cycles in and out of thermal
shutdown as long as the ON pin is active and the short
is present.
Board Layout
For best performance, all traces should be as short as
possible. To be most effective, the input and output
capacitors should be placed close to the device to
minimize the effects that parasitic trace inductances
may have on normal and short-circuit operation. Using
wide traces for VIN, VOUT, and GND help to minimize
parasitic electrical effects along with minimizing the
case-to-ambient thermal impedance.
© 2009 Fairchild Semiconductor Corporation
FPF2193/4/5 • Rev. 1.0.9
12
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Physical Dimensions
0.03 C
2X
E AF
B
BALL A1
INDEX AREA
D
TOP VIEW
0.03 C
2X
0.05 C
0.06 C
0.625
0.539
E
(Ø0.350)
SOLDER MASK
OPENING
A1
(Ø0.250)
Cu Pad
(1.00)
(0.50)
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.332±0.018
0.250±0.025
C SEATING PLANE D
SIDE VIEWS
0.50
0.005 C A B
Ø0.315 +/- .025
6X
1.00
0.50
12
C
B (Y) ±0.018
A
F
(X) ±0.018
BOTTOM VIEW
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
±43 MICRONS (539-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC006AFrev2.
Figure 29. 6-Ball, Wafer-Level Chip-Scale Package (WLCSP)
D
1.480±0.030
E
0.980±0.030
X
0.240
Y
0.240
© 2009 Fairchild Semiconductor Corporation
FPF2193/4/5 • Rev. 1.0.9
13
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14
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