Fairchild Semiconductor Electronic Components Datasheet



FPF2026

Full Functional Load Switch


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April 2016
FPF2024/25/26/27
Full Functional Load Switch with 100 mA Current Limit
Features
1.6 V to 5.5 V Input Voltage Range
Ultra Low Average Quiescent Current 1 μA
Typical at1.8 V
Typical RDS(ON) = 225 at VIN = 3.3 V
Typical RDS(ON) = 280 at VIN = 1.8 V
100 mA Fixed Current Limit Minimum
Under-Voltage Lockout (UVLO)
CMOS and Open Drain Fault Flag Options
Fault Blanking
Auto Restart
Thermal Shutdown
ESD Protection
o >5500 V HBM
o >1500 V CDM
Applications
PDAs
Cell Phones
GPS Devices
Digital Cameras
Peripheral Ports
MP3 Players
Description
The FPF2024/5/6/7 are low RDS(ON) P-Channel MOSFET
load switches with 150 mA typical current limit value
targeting small package load switch applications. The
extended input voltage range spans from 1.6 V to 5.5 V
to fulfill today's ultra-portable device's supply
requirements. Switch control is by a logic input (ON)
capable of interfacing directly with a low voltage control
signal.
The FPF2024/25/26/27 respond to an output overload
condition by going into constant current mode where the
output current is regulated by the load switch. If the
over-current condition persists beyond the 10 ms
Blanking Time, the FPF2024 and FPF2025 pull the fault
signal pin (FLAGB) low and shut-off the switch. An Auto-
Restart feature turns the FPF2024 and FPF2025 on
again after 70 ms if the ON pin is still active. The
FPF2026 has a Latch-Off feature which shuts off the
switch off after the expiration of the 10 ms Blanking
Time and keeps it off until the ON pin is toggled. The
FPF2027 responds to an overload condition by
immediately pulling the fault signal pin LOW and the
switch remains in constant current mode until the output
overload condition is removed. The FPF2027 has a
Startup Blanking feature which prevents startup
transient over-current conditions from triggering the fault
signal pin for 10 ms after initial turn on via the ON pin.
These parts are available in a space-saving 6-ball
advanced. Pb-Free 1.0 x1.5 mm2 CSP package.
© 2008 Fairchild Semiconductor Corporation
FPF2024/25/26/27 • Rev. 1.1
Figure 1. 6-Ball 1.0 x1.5 mm2 CSP Package
www.fairchildsemi.com


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Ordering Information
Part Number
FPF2024
FPF2025
FPF2026
FPF2027
Min. Limit
[mA]
100
100
100
100
Blank Current
Limit Time
[ms]
Auto-Restart
Time [ms]
10 70
10 70
10 n/a
0 n/a
Typical Application
ON Pin
Activity
Active HI
Active LO
Active HI
Active HI
FLAGB
Top Mark
Open Drain
CMOS
Open Drain
Open Drain
S2
S3
S4
S5
Block Diagram
Figure 2. Typical Application
© 2008 Fairchild Semiconductor Corporation
FPF2024/25/26/27 Rev. 1.1
Figure 3. Block Diagram
2
www.fairchildsemi.com


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Pin Configuration
Figure 4. Pin Assignment 1.0 x 1.5 CSP Bottom View
Pin Description
Pin Name
Function
A1 VOUT Switch Output. Output of the power switch.
A2 VIN Supply Input. Input to the power switch and the supply voltage for the IC.
B1 GND Ground.
B2 NC No Connection.
C1
FLAGB
Fault Output. Active LOW, open drain output for PFPF2024/26/27 and CMOS output for
FPF2025. FLAGB indicates an over-current, supply under-voltage or over-temperature state.
C2 ON ON/OFF Control Input. Active HIGH for FPF2024/26/27 and Active LOW for FPF2025.
© 2008 Fairchild Semiconductor Corporation
FPF2024/25/26/27 Rev. 1.1
3
www.fairchildsemi.com


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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Symbol
Parameter
VIN
PD
ISW
TA
TSTG
JA
ESD
VIN, VOUT, ON, FLAG, GND
Power Dissipation at TA=25°C(1)
Maximum Continuous Switch Current
Operating Temperature Range
Storage Junction Temperature
Thermal Resistance, Junction-to-Ambient
Electrostatic Discharge Capability
Human Body Model
Charged Device Model
Note:
1. Package power dissipation on 1 square inch pad, 2 oz. copper board.
Min.
-0.3
-40
-65
Max.
6.0
1.2
0.2
125
150
85
5500
1500
Unit
V
W
A
°C
°C
°C/W
V
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance. Fairchild does not recommend exceeding them or
designing to Absolute Maximum Ratings.
Symbol
Parameter
VIN Input Voltage
TA Ambient Operating Temperature
Min.
1.6
-40
Max.
5.5
85
Unit
V
°C
© 2008 Fairchild Semiconductor Corporation
FPF2024/25/26/27 Rev. 1.1
4
www.fairchildsemi.com


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Electrical Characteristics
Unless otherwise noted, VIN=1.6 to 5.5 V and TA=-40 to +85°C. Typical values are at VIN=3.3 V and TA=25°C.
Symbol
Parameter
Conditions
Min. Typ. Max. Unit
Basic Operation
VIN
IQ
ISD
RON
VIH
VIL
ION
ISWOFF
Operating Voltage
Quiescent Current
Shutdown Current
On Resistance
On Input Logic HIGH Voltage
On Input Logic LOW Voltage
On Input Leakage
Off Switch Leakage
FLAGB Output Logic Low Voltage
FLAGB Output Logic High Voltage
FLAGB Output High Leakage
Current
IOUT=0 mA, VON Active, VIN=1.8 V
(Average)
VON=VIN, (FPF2025) VON=GND
(FPF2024/26/27), IOUT=0
TA=25°C, VIN=5.5 V
TA=-40 to 85°C, VIN=5.5 V
TA=25°C,VIN=3.3 V
TA= -40 to +85°C, VIN=3.3 V
TA= 25°C,VIN=1.6 V
TA= -40 to +85°C, VIN=1.6 V
VIN=1.6 V
VIN=5.5 V
VIN=1.6 V
VIN=5.5 V
VON=VIN or GND
VON=VIN, VOUT=0 V
VIN=5.5 V, ISINK=1 mA
VIN=1.8 V, ISINK=1 mA
VIN=5.5 V, ISOURCE=1 mA, FPF2025
VIN=1.6 V, ISOURCE=1 mA, FPF2025
VIN=5.5 V, Switch On,
FPF2024, FPF2026, FPF2027
1.6
120
140
180
0.8
1.5
5.2
1.20
1
215
215
225
225
305
305
0.1
0.1
5.4
1.35
5.5 V
4 μA
1 μA
315
350
325
360
490
580
V
0.45
V
0.9
1.0 μA
1.0 μA
0.2
V
0.3
V
1.0 μA
Protections
ILIM Current Limit
Thermal Shutdown
VIN=3.3 V, VOUT=3.0 V,TA=25°C
Shutdown Threshold TJ Increasing
Return from Shutdown
100 150 200 mA
140
130 °C
Hysteresis
10
UVLO
Under-Voltage Lockout
UVLOH Under-Voltage Lockout Hysteresis
Dynamic Characteristics
tON Turn-On Time
tOFF Turn-Off Time
tRISE
VOUT Rise Time
tBLANK Over-Current Blanking Time
TSTART_BLANK Startup FLAGB Blanking Time
tRSTRT Auto-Restart Time
Sleep Mode Duration
VIN Increasing
RL = 500 Ω, CL = 0.1 μF
RL = 500 Ω
RL = 500 Ω, CL = 0.1 μF
FPF2024, FPF2025, FPF2026
FPF2027(2)
FPF2024, FPF2025
1.475 1.525 1.575 V
40 mV
5
5
35
128.5
70
10
30
10
10
70
257.0
20
20
140
514.0
μs
μs
μs
ms
ms
ms
ms
Wake-up Mode Duration
0.5 1.0 2.0 ms
Duty Cycle
Current Limit Response Time
Blanking/Auto-Restart Duty Ratio
Wake-up: Sleep Mode Duty Cycle
Moderate Over-Current Condition
RL= 5
tBLANK /tRSTRT (Internally Fixed)
FPF2024, FPF2025
1:257
15
1:7
μs
Note:
2. FPF2027 has a 10 ms Startup FLAGB Blanking Time when the part is turned on via ON pin to ensure transient
load currents settle down.
© 2008 Fairchild Semiconductor Corporation
FPF2024/25/26/27 Rev. 1.1
5
www.fairchildsemi.com


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Typical Performance Characteristics
Figure 5. Shutdown Current vs. Temperature
Figure 6. TRestart vs. Temperature
Figure 7. Quiescent Current vs. Temperature
Figure 8. TBlank vs. Temperature
Figure 9. RDS(ON) vs. VIN
Figure 10. RDS(ON) vs. Temperature
© 2008 Fairchild Semiconductor Corporation
FPF2024/25/26/27 Rev. 1.1
6
www.fairchildsemi.com


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Typical Performance Characteristics (Continued)
Figure 11. ILimit vs. VIN
Figure 12. ILimit vs. Temperature
Figure 13. VIH, VIL vs. Temperature
Figure 14. FPF2024 tON Response
Figure 15. FPF2024 tOFF Response
Figure 16. FPF2024 TBLANK Response(3)
© 2008 Fairchild Semiconductor Corporation
FPF2024/25/26/27 Rev. 1.1
7
www.fairchildsemi.com


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Typical Performance Characteristics (Continued)
Figure 17. FPF2024 TRESTART Response(3)
Figure 18. FPF2024 Current Limit Response Time
(Output is loaded by 5 Ω and COUT = 10 μF)
Figure 19. FPF2024 Current Limit Response Time Figure 20. FPF2024 Short Circuit Response Time
(Output is loaded by 5 Ω and COUT = 100 μF)
(Output shorted to GND while the switch is in normal
operation)
Figure 21. FPF2024 Current Limit Response
(Input and enable pin are tied together and VOUT
is shorted to GND)
Figure 22. FPF2027 Over-Current(3)
Over-Current condition is applied while device in
normal operation (FLAGB inserts immediately and
reports the fault condition)
© 2008 Fairchild Semiconductor Corporation
FPF2024/25/26/27 Rev. 1.1
8
www.fairchildsemi.com


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Typical Performance Characteristics (Continued)
Figure 23. FPF2027 Startup FLAGB Blanking Time
Figure 24. FPF2025 TBLANK and TRESTART
(Active LO Device)
Note:
3. VDRV signal forces the device to go into over-current condition by loading a 7.5 Ω.
© 2008 Fairchild Semiconductor Corporation
FPF2024/25/26/27 Rev. 1.1
9
www.fairchildsemi.com


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Description of Operation
FPF2024-FPF2027 series Full-Function switches are
current limited load switches with ultra-low power
consumption. The core of each device consists of a
230 mW P-channel MOSFET featuring slow turn-on to
limit the inrush current, fast turn-off, current limit, Under-
Voltage Lockout (UVLO) and thermal shutdown
protection features and a FLAGB output that indicates
that a fault condition has occurred.
Some versions in the FPF202x series also feature
Current Limit Blanking and Auto-Restart.
The FPF202x family achieves an ultra-low current
consumption of 1 μA through a proprietary “Sleep and
Wake-up Modes” implementation. Full functionality is
guaranteed for operating voltages down to 1.6 V over
the -40°C to +85°C temperature range.
Sleep and Wakeup Mode Description
The ultra-low power consumption of FPF2024-FPF2027
is achieved through the implementation of proprietary
Sleep/ Wakeup modes.
The FPF2024-FPF2027 family turns on in Startup mode
where it checks for potential load current, temperature,
and under-voltage faults for 10 ms. If no faults are
detected during this startup period, the FPF2024-
FPF2027 goes into a Sleep mode where it stays for
257 ms. At the end of the Sleep period, the part goes
into Wakeup mode to check for any fault condition. If no
fault is detected in 1 ms, the part goes back to Sleep
mode. The 1:257 Wakeup/Sleep duty cycle results in an
overall average current consumption of 1 μA (typical).
During Sleep mode the thermal and under-voltage
conditions are not monitored to reduce the current
consumption of the device.
The switch current limiting circuitry is active at all times
and protects the FPF2024-FPF2027 against excessive
load currents in all modes. While in the Wakeup mode,
a current fault event will prevent the part from re-
entering into Sleep mode even if input voltage and
temperature faults are not present. In such a case, the
part functions according to its feature set, e.g., it
performs its normal Blanking, Auto-Restart or Latch-off
functions as expected. If the over-current condition is
removed from the output, the part will go back into
Sleep mode after 10ms. The representative state
diagrams of the FPF2024-FPF2027 are given in Figure
25, Figure 26 and Figure 27.
The ultra-low quiescent current consumption of 1 μA
along with the very-low minimum operating voltage of
1.6 V, make the FPF2024-FPF2027 an ideal full-
function load switch for ultraportable applications.
On/Off Control
The ON pin controls the state of the switch. The
FPF2024- FPF2027 series features both active high and
low configurations to accommodate various application
requirements. FPF2024, FPF2026 and FPF2027 are
active high switches while the FPF2025 is an active low
device. Applying a continuous high or low signal
depending on the switch configuration, will hold the
switch in the ON state. The load switch will move into
the OFF state when the ON pin is inactive. In addition,
FPF2026 moves into the OFF state if a current fault is
encountered for longer duration than the Blanking Time.
For all versions, an under-voltage on VIN or a junction
temperature in excess of 140°C overrides the ON
control and turns off the switch.
In addition, a current fault condition longer than the
Blanking Time will cause the switch to turn off in the
FPF2024, FPF2025 and FPF2026. The FPF2024 and
FPF2025 have an Auto-Restart feature which will
automatically turn the switch on again after 70 ms. For
the FPF2026, the ON pin must be toggled to turn the
switch on again. The FPF2027 does not turn off in
response to an over-current condition, and remains in a
constant current mode for so long as the ON pin is
active, and the thermal shutdown or UVLO are not
activated.
The ON pin control voltage and VIN pin have
independent recommended operating ranges. The ON
pin voltage can be driven by a voltage level higher than
the input voltage.
Fault Reporting
Over-current, input under-voltage, or over-temperature
fault conditions are signaled out by the FLAGB pin going
low. FPF2024, FPF2025 and FPF2026 have a current
fault blanking feature which prevents current faults
lasting shorter than the Blanking Time of 10 ms (typical)
from triggering the fault signal (FLAGB) output.
If the over-current condition persists beyond the
Blanking Time, the FPF2024 and FPF2025 pull the
FLAGB pin low and shut the switch off. If the ON pin is
kept active, an Auto-Restart feature releases the
FLAGB pin and turns the switch on again after 70 ms.
If the over-current condition persists beyond the
Blanking Time, the FPF2026 has a Latch-Off feature
which pulls the FLAGB pin low and shuts the switch off.
The switch is kept off and the FLAGB pin is kept low
until the ON pin is toggled.
The FPF2027 responds to an overload condition by
immediately pulling the FLAGB pin low and the switch
remains in constant current mode until the output
overload condition is removed. The FPF2027 has a
Startup Blanking feature which prevents current faults
related to startup transients from triggering the FLAGB
output. The Startup Blanking feature is effective for the
first 10 ms (typical) following device turn-on via ON pin.
The FPF2024, FPF2026 and FPF2027 have an open-
drain MOSFET FLAGB output which requires a pull-up
resistor between VIN and FLAGB. A 100 KΩ pull up
resistor is recommended. The FPF2025 has a CMOS
FLAGB output and does not require a pull-up resistor.
During shutdown, the pull-down on FLAGB is disabled
to reduce current draw from the supply.
© 2008 Fairchild Semiconductor Corporation
FPF2024/25/26/27 Rev. 1.1
10
www.fairchildsemi.com


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Current Limiting
The current limit function ensures that the current
through the switch does not exceed a maximum value
while not limiting at less than a minimum value. The
minimum current at which the parts will limit the load
current is internally set to 100 mA.
The switch current limiting circuitry is active at all times
(Sleep and Wakeup mode) and protects the FPF2024-
FPF2027 against excessive load currents in all modes.
The proprietary current limiting circuit responds to an
over-current condition in 15 μs (typical).
Under-Voltage Lockout (UVLO)
The under-voltage lockout feature turns-off the switch if
the input voltage drops below the under-voltage lockout
threshold. With the ON pin active, the input voltage
rising above the under-voltage lockout threshold will
cause a controlled turn-on of the switch and will limit
current over-shoots. The UVLO feature is disabled
during Sleep mode. If device is in the UVLO condition,
FLAGB goes low and indicates the fault. If the input
voltage goes below UVLO voltage but remains above
1.3 V (typical) during Sleep mode, the switch is kept on
until the next Wakeup cycle, where the UVLO violation
will be detected. If the input voltage falls below 1.3 V in
Sleep mode, the switch is immediately turned off.
Thermal Shutdown
The Thermal Shutdown protects the device from
internally or externally generated excessive
temperatures. The Thermal shutdown feature is
disabled during Sleep mode. However, excessive load
currents that may result in high power dissipation will be
detected during Sleep mode and will activate the full
function Wakeup mode, which has thermal shutdown
protection. During an over-temperature condition the
FLAGB is pulled low and the switch is turned-off. If the
temperature of the die drops below the threshold
temperature, the switch automatically turns on again, To
avoid unwanted thermal oscillations, a 10°C (typical)
thermal hysteresis is implemented between thermal
shutdown entry and exit temperatures.
Figure 25. State Diagram with Blanking and Auto-Restart (FPF2024/5)
© 2008 Fairchild Semiconductor Corporation
FPF2024/25/26/27 Rev. 1.1
11
www.fairchildsemi.com


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Figure 26. State Diagram with Blanking Only (No Auto-Restart FPF2026)
© 2008 Fairchild Semiconductor Corporation
FPF2024/25/26/27 Rev. 1.1
12
www.fairchildsemi.com


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Figure 27. State Diagram with No Blanking (FPF2027)
© 2008 Fairchild Semiconductor Corporation
FPF2024/25/26/27 Rev. 1.1
13
www.fairchildsemi.com


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Application Information
Input Capacitor
To limit the voltage drop on the input supply caused by
transient in-rush currents when the switch is turned on
into a discharged load capacitor or a short-circuit, a
capacitor is recommended to be placed between VIN
and GND. The FPF2024-FPF2027 series feature a slow
turn-on to limit the inrush current and requires a smaller
input capacitor. A 1 µF ceramic capacitor, CIN, placed
close to the pins is typically sufficient. Higher values of
CIN can be used to further reduce the voltage drop.
Output Capacitor
A 0.1 µF capacitor COUT, should be placed between
VOUT and GND. This capacitor will prevent parasitic
board inductances from forcing VOUT below GND when
the switch turns-off. For the FPF2024, FPF2025 and
FPF2026, the total output capacitance needs to be kept
below a maximum value, COUT(MAX), to prevent the part
from registering an over-current condition beyond the
Blanking Time and turning-off the switch. The maximum
output capacitance can be determined from the
following formula:
(1)
Power Dissipation
During normal operation as a switch, the power
dissipation is small and has little effect on the operating
temperature of the part. The maximum power
dissipation while switch is in normal operation occurs
just before a part enters the current limit. This may be
calculated using the formula bellow:
(2)
If the part goes into current limit, the maximum power
dissipation occurs when the output of switch is shorted
to ground. For the FPF2024 and FPF2025, the power
dissipation will scale with the Auto-Restart Time, tRSTRT,
and the Over Current Blanking Time, tBLANK. In this case
the maximum power dissipated for the FPF2024 and
FPF2025 is:
(3)
This power dissipation is significant enough that it will
activate the thermal shutdown protection, and the part
will cycle in and out of thermal shutdown so long as the
ON pin is active and the output short is present.
Improving Thermal Performance
An improper layout could result in higher junction
temperature and ultimately trigger the thermal shutdown
protection feature. This concern applies particularly
significant for the FPF2027 where the switch is in
constant current mode in the overload conditions.
The following techniques have been identified to
improve the thermal performance of this family of
devices. These techniques are listed in order of the
significance of their impact.
NC pin can be connected to the GND plane to
improve thermal performance.
The VIN, VOUT and GND pins will dissipate most of
the heat generated during a high load current
condition. Using wide traces will help minimize
parasitic electrical effects, along with minimizing the
case to ambient thermal impedance. The layout
suggested in Figure 28 provides each pin with
adequate copper so that heat may be transferred
out of the device as efficiently as possible. The low-
power FLAGB and ON pin traces may be laid-out to
maximize the area available to the ground pad.
Placing the input and output capacitors as close to
the device as possible also contributes to heat
dissipation, particularly during high load currents.
FPF202X Demo Board
FPF202X Demo board has components and circuitry to
demonstrate the functions and features of the FPF202X
load switch family. An N-Channel MOSFET(Q), in series
with a 7.5 Ω resistor, are connected between VOUT and
the GND pin of the device. By turning on the Q
transistor, the 7.5 Ω is loaded to the output voltage and
simulates an over-current condition. The R2 resistor is
connected between FLAGB pin and input voltage as
pull-up resistor for FPF2024, FPF2026 and FPF2027
devices. The FPF2025 does not require a pull-up
resistor due to its CMOS output structure.
The thermal performance of the board is improved using
the techniques recommended in the layout
recommendations section of datasheet.
Take note that this is below the maximum package
power dissipation, and the thermal shutdown feature
protection provides additional safety to protect the part
from damage due to excessive heating. The junction
temperature is only able to increase to the thermal
shutdown threshold. Once this temperature has been
reached, toggling ON will have no effect until the
junction temperature drops below the thermal shutdown
exit temperature. For the FPF2027, a short on the
output will cause the part to operate in a constant
current state dissipating a worst case power of:
(4)
Output of FPF2027 is shorted to GND.
© 2008 Fairchild Semiconductor Corporation
FPF2024/25/26/27 Rev. 1.1
14
Figure 28. FPF2020X Proper Layout
www.fairchildsemi.com


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Figure 29. Top Layer
Figure 30. Bottom Layer
Figure 31. SST
Figure 32. TOP, SST and SMT
The information below pertains to the WLCSP outline drawing on the following page.
Product Specifications
Product
D
E
X
FPF2024/5/6/7
1.500 ±0.030
1.000 ±0.030
0.240
Y
0.240
© 2008 Fairchild Semiconductor Corporation
FPF2024/25/26/27 Rev. 1.1
15
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0.03 C
2X
E AF
B
BALL A1
INDEX AREA
D
TOP VIEW
0.03 C
2X
0.05 C
0.06 C
0.625
0.539
E
(Ø0.350)
SOLDER MASK
OPENING
A1
(Ø0.250)
Cu Pad
(1.00)
(0.50)
RECOMMENDED LAND PATTERN
(NSMD PAD TYPE)
0.332±0.018
0.250±0.025
C SEATING PLANE D
SIDE VIEWS
0.50
0.005 C A B
Ø0.315 +/- .025
6X
1.00
0.50
12
C
B (Y) ±0.018
A
F
(X) ±0.018
BOTTOM VIEW
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE
PER ASMEY14.5M, 1994.
D. DATUM C IS DEFINED BY THE SPHERICAL
CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS 582 MICRONS
±43 MICRONS (539-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC006AFrev3.


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