FPF3040 Datasheet PDF
No Preview Available !

Click to Download PDF File

November 2014
FPF3040
IntelliMAX18 V-Rated Dual Input Single Output
Power-Source-Selector Switch
Features
Dual-Input, Single-Output Load Switch
Input Supply Operating Range:
- 4~10.5 V at VIN
- 4~6.5 V at VBUS
Typical RON:
- 95 mΩ at VIN=5 V
- 70 mΩ at VBUS=5 V
Bi-Directional Switch for VIN and VBUS
Slew Rate Controlled:
- 50 µs at VIN for < 4.7 µF COUT
- 90 µs at VBUS for < 4.7 µF COUT
Maximum ISW: 2 A Per Channel
Break-Before-Make Transition
Under-Voltage Lockout (UVLO)
Over-Voltage Lockout (OVLO)
Thermal Shutdown
Logic CMOS IO Meets JESD76 Standard for GPIO
Interface and Related Power Supply Requirements
ESD Protected:
- Human Body Model: >3 kV
- Charged Device Model: >1.5 kV
- IEC 61000-4-2 Air Discharge: >15 kV
- IEC61000-4-2 Contact Discharge: >8 kV
Description
The FPF3040 is a 18 V-rated Dual-Input Single-Output
(DISO) load switch consisting of two channels of slew-
rate-controlled, low-on-resistance, N-channel MOSFET
switches with protection features. The slew-rate-
controlled turn-on characteristic prevents inrush current
and the resulting excessive voltage droop on the input
power rails. The input voltage range operates from
4 V to 6.5 V at VBUS and from 4 V to 10.5 V at VIN to
align with the needs of low-voltage portable device
power rails.
VIN and VBUS have the over-voltage protection
functionality of typical 12 V and 7.5 V, respectively, to
avoid unwanted damage to system.
VIN and VBUS bi-directional switching allows reverse
current from VOUT to VIN or VBUS for On-The-Go, (OTG)
Mode. The switching is controlled by logic input EN and
VIN_SEL is capable of interfacing directly with low-voltage
control signal General-Purpose Input / Output (GPIO).
FPF3040 is available in 1.8 mm x 2.0 mm Wafer-Level
Chip-Scale Package (WLCSP), 16-bump, 0.4 mm pitch.
Applications
Input Power Selection Block Supporting USB and
Wireless Charging
Smartphone / Tablet PC
Ordering Information
Part Number
FPF3040UCX
Top
Mark
QY
Channel
DISO
Typical RON per
Channel at 5VIN
95 for VIN
70 for VBUS
Rise Time (tR)
Package
50 µs for VIN 1.8 mm x 2.0 mm Wafer-Level Chip-Scale
90 µs for VBUS Package (WLCSP), 16-Bump, 0.4 mm Pitch
© 2012 Fairchild Semiconductor Corporation
FPF3040 • Rev. 2.4.3
www.fairchildsemi.com

Total : 14 Pages
Click to Download Full PDF File