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WEDPNF8M721V-1210BM Datasheet

Part Number WEDPNF8M721V-1210BM
Manufacturers ETC
Logo ETC
Description 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
Datasheet WEDPNF8M721V-1210BM DatasheetWEDPNF8M721V-1210BM Datasheet (PDF)

White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n n Package: • 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight: • WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture • One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode • One 8K word, two 4K words, one 16K word, and fifteen 32K word sectors in word mode. • Any combina.

  WEDPNF8M721V-1210BM   WEDPNF8M721V-1210BM






Part Number WEDPNF8M721V-1210BI
Manufacturers ETC
Logo ETC
Description 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
Datasheet WEDPNF8M721V-1210BM DatasheetWEDPNF8M721V-1210BI Datasheet (PDF)

White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n n Package: • 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight: • WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture • One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode • One 8K word, two 4K words, one 16K word, and fifteen 32K word sectors in word mode. • Any combina.

  WEDPNF8M721V-1210BM   WEDPNF8M721V-1210BM







Part Number WEDPNF8M721V-1210BC
Manufacturers ETC
Logo ETC
Description 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
Datasheet WEDPNF8M721V-1210BM DatasheetWEDPNF8M721V-1210BC Datasheet (PDF)

White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n n Package: • 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight: • WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture • One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode • One 8K word, two 4K words, one 16K word, and fifteen 32K word sectors in word mode. • Any combina.

  WEDPNF8M721V-1210BM   WEDPNF8M721V-1210BM







8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package

White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n n Package: • 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight: • WEDPNF8M721V-XBX - 2.5 grams typical n n n n Sector Architecture • One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode • One 8K word, two 4K words, one 16K word, and fifteen 32K word sectors in word mode. • Any combination of sectors can be concurrently erased. Also supports full chip erase Boot Code Sector Architecture (Bottom) Embedded Erase and Program Algorithms Erase Suspend/Resume • Supports reading data from or programing data to a sector not being erased SDRAM PERFORMANCE FEATURES n n n n n n n n Organized as 8M x 72 High Frequency = 100, 125MHz Single 3.3V ±0.3V power supply Fully Synchronous; all signals registered on positive edge of system clock cycle Internal pipelined operation; column address can be changed every clock cycle Internal banks for hiding row access/precharge Programmable Burst length 1,2,4,8 or full page 4096 refresh cycles BENEFITS n n n n n n 42% SPACE SAVINGS Reduced part count Reduced I/O count • 14% I/O Reduction Suitable for hi-reliability applications SDRAM Upgradeable to 16M x 72 density (contact factory for information) Flash upgradeable to 2M x 8 (or 1M x 16 or 512K x 32) density FLASH PERFORMANCE FEATURES n n n n User Configurable as 1Mx8 or 512Kx16 Access T.


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