WED3C7410E16M-XBHX

www.datasheet4u.com White Electronic Designs WED3C7410E16M-XBHX PRELIMINARY* 7410E RISC Microprocessor HiTCE™ Multichip Package OVERVIEW The WEDC 7410E/SSRAM multichip package is targeted for high performance, space sensitive, low power systems and supports the following power management features: doze, nap, sleep and dynamic power management. The WED3C7410E16M-XBHX multichip package consists of: 7410E AltiVec™ RISC processor Dedicated 2MB SSRAM L2 cache, configured as 256Kx72 21mmx25mm, 255 HiTCE™ Ball Grid Array (CBGA) Core frequency = 450 or 400MHz @ 1.8V Maximum L2 Cache frequency = 200MHz Maximum 60x Bus frequency = 100MHz * This product is under development, is not qualified or characterized and is subject to change without notice. The WED3C7410E16M-XBHX is offered in Commercial (0°C to +70°C), industrial (-40°C to +85°C) and military (-55°C to +125°C) temperature ranges and is well suited for embedded applications such as missiles, aerospace, flight computers, fire control systems and rugged critical systems. FEATURES Footprint compatible with WED3C7410E16M-XBX, WED3C7558M-XBX and WED3C750A8M-200BX Implementation of Altivec™ technology instruction set Optional, high-bandwidth MPX bus interface HiTCE™ interposer for TCE compatibility to laminate substrates for increased Board level reliability Available with eutectic or high lead solder balls FIGURE 1 – MULTI-CHIP PACKAGE DIAGRAM AltiVec™ is a trademark of Motorola Inc. HiTCE™ is a trademark of Kyocera Corp. July 20...