U05NH44,U05TH44
TOSHIBA RECTIFIER SILICON DIFFUSED TYPE
U05NH44,U05TH44
HIGH SPEED RECTIFIER APPLICATIONS (FAST RECOVERY)
Repetitive Peak Reverse Voltage: VRRM = 1000, 1500V Average Forward Current: IF (AV) = 0.5A Reverse Recovery Time: trr = 4µs Surface Mounting Plastic Mold Package Unit: mm
MAXIMUM RATINGS (Ta = 25°C)
CHARACTERISTIC Repetitive Peak Reverse Voltage Average Forward Current I t Limit Value (t = 1~10ms) Peak One Cycle Surge Forward Current (NonRepetitive) Junction Temperature Range Storage Temperature Range
2
SYMBOL VRRM IF (AV) I t IFSM Tj Tstg
2
RATING 1000 1500 0.5 2 20 (50Hz) −40~125 −40~125
UNIT V A A s A °C °C
2
U05NH44 U05TH44
JEDEC JEITA TOSHIBA
― ― 34D1A
Weight: 0.06 g (typ.)
ELECTRICAL CHARACTERISTICS (Ta = 25°C)
CHARACTERISTIC Peak Forward Voltage Repetitive Peak Reverse Current Reverse Recovery Time SYMBOL VFM IRRM trr TEST CONDITION IFM = 0.5A VRRM = Rated IF = 20mA, IR = 1mA MIN ― ― ― TYP. ― ― ― MAX 1.5 10 4 UNIT V µA µs
MARKING
Abbreviation Code NH TH Part No. U05NH44 U05TH44
STANDARD SOLDERING PAD
1
20040701
U05NH44,U05TH44
Handling Precaution
The maximum ratings denote the absolute maximum ratings, which are rated values and must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend when you design a circuit with a device. VRRM: We recommend that the worst case voltage, including surge voltage, be no greater than 80% of the maximum rating of VRRM for a DC circuit and be no greater than 50% of that of VRRM for an AC circuit. VRRM has a temperature coefficient of 0.1%/°C. Take this temperature coefficient into account designing a device at low temperature. We recommend that the worst case current be no greater than 80% of the maximum rating of IF(AV). Carry out adequate heat design. If you can’t design a circuit with excellent heat radiation, set the margin by using an allowable TamaxIF(AV) curve.
IF(AV):
This rating specifies the nonrepetitive peak current in one cycle of a 50Hz sine wave, condition angle 180. Therefore, this is only applied for an abnormal operation, which seldom occurs during the lifespan of the device. We recommend that a device be used at a Tj of below 100°C under the worst load and heat radiation conditions. Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When using a device, design a circuit board and a soldering land size to
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