TSP2-QF2012A3

0805 PACKAGE CHIP LED TSP2-QF2012A3 0805 Package Chip LED Features Package in 8mm tape on 7” diameter reel Compatible with automatic placement equipment Compatible with infrared and vapor phase reflow solder process Mono-color type RoHS compliance QSLP2QF2 Applications Automotive: Backlighting in dashboards and switch Telecommunication: indicator and backlighting in telephone and fax Flat backlight for LCD, switches and symbols General Use Descriptions This SMD Taping is much smaller than leaded components, thus enable smaller board higher packing density, reduced storage space and finally smaller equipment to be obtained. Light weight makes them ideal for miniature applications Device Selection Guide Chip Part No. Material AlGaInP Emitted Color Hyper Red Lens Color TSP2-QF2012A3 Water Clear TAITRON COMPONENTS INCORPORATED www.taitroncomponents.com Tel: (800)-247-2232 (800)-TAITRON (661)-257-6060 Fax: (800)-TAITFAX (800)-824-8329 (661)-257-6415 Rev. A/JY Page 1 of 7 Free Datasheet http://www.datasheet4u.com/ 0805 PACKAGE CHIP LED TSP2-QF2012A3 Absolute Maximum Ratings (Ta=25°C) Parameter Reverse Voltage Forward Current Peak Forward Current (Duty 1/10 @1KHz) Power Dissipation Electrostatic Discharge Soldering Temperature Operating Temperature Storage Temperature Symbol Value 5 25 160 60 2000 260 (for 5 seconds) -40 ~ +85 -40 ~ +90 Unit V mA mA mW V °C °C °C VR IF IF(Peak) Pd ESD Tso Topr Tstg Electro-Optical Characteristics (Ta=25°C) Parameter ...