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TLBD1100B Datasheet

Part Number TLBD1100B
Manufacturers Toshiba Semiconductor
Logo Toshiba Semiconductor
Description Panel Circuit Indicator
Datasheet TLBD1100B DatasheetTLBD1100B Datasheet (PDF)

TL(BD,EGD)1100B(T11) TOSHIBA LED Lamps www.DataSheet4U.com TLBD1100B(T11), TLEGD1100B(T11) Unit: mm Panel Circuit Indicator • • • • • • • • • • Surface-mount devices 3.2 (L) × 2.8 (W) × 1.9 (H) mm Flat-top type InGaN LEDs High luminous intensity Low drive current, high-intensity light emission Colors: Blue Green λd=470nm(typ) λd=528nm(typ) Pb free reflow soldering is possible Applications: automotive use, message signboards, backlighting etc. Standard embossed tape packing: T11 (2000/reel) 8-.

  TLBD1100B   TLBD1100B






Panel Circuit Indicator

TL(BD,EGD)1100B(T11) TOSHIBA LED Lamps www.DataSheet4U.com TLBD1100B(T11), TLEGD1100B(T11) Unit: mm Panel Circuit Indicator • • • • • • • • • • Surface-mount devices 3.2 (L) × 2.8 (W) × 1.9 (H) mm Flat-top type InGaN LEDs High luminous intensity Low drive current, high-intensity light emission Colors: Blue Green λd=470nm(typ) λd=528nm(typ) Pb free reflow soldering is possible Applications: automotive use, message signboards, backlighting etc. Standard embossed tape packing: T11 (2000/reel) 8-mm tape reel Color and Material Product Name TLBD1100B TLEGD1100B Color Blue Green Material InGaN JEDEC JEITA TOSHIBA Weight: 0.035 g (typ.) ― ― 4-3R1 Absolute Maximum Ratings (Ta = 25°C) Product Name TLBD1100B TLEGD1100B Forward Current IF (mA) Please see Note 1 30 Reverse Voltage VR (V) 4 Power Dissipation PD (mW) 120 Operation Temperature Topr (°C) −40~100 Storage Temperature Tstg (°C) −40~100 Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, et.


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