TB3101

TB3101 MCP2551 to MCP2561 Migration Author: Wilhelm Leichtfried Microchip Technology Inc. FIGURE 1: PINOUT DIFFERENCES MCP2551 PDIP, SOIC MCP2561 PDIP, SOIC INTRODUCTION The MCP2561 is Microchip’s second generation CAN transceiver. Although major improvements have been made, resulting in increased EMC performance and much lower current consumption, the differences in using the MCP2561 versus the MCP2551 are minor. Figure 1 shows the differences in pinout. The MCP2561 can be used as a drop-in replacement for the MCP2551 if the differences listed in Table 1 are considered. TXD 1 VSS 2 VDD 3 RXD 4 8 RS 7 CANH 6 CANL 5 VREF TXD 1 VSS 2 VDD 3 RXD 4 8 STBY 7 CANH 6 CANL 5 SPLIT The MCP2561 also adds a new leadless package type, 8LD 3x3 DFN, allowing for smaller form factor package requirements. This package features pin 9, Exposed Thermal Pad, and has the same pinout as the PDIP and SOIC packages. For further information on these differences and on the new models available, plea...