DatasheetsPDF.com

SSM200UF3A Datasheet

Part Number SSM200UF3A
Manufacturers Sensitron
Logo Sensitron
Description (SSMxxxUF3A) HERMETIC ULTRAFAST DIODE
Datasheet SSM200UF3A DatasheetSSM200UF3A Datasheet (PDF)

www.DataSheet4U.com SENSITRON SEMICONDUCTOR TECHNICAL DATA DATASHEET 4241, Rev- SXX175UF3A SXX200UF3A SXX225UF3A SXX250UF3A HERMETIC ULTRAFAST DIODE Description: 3Amp, 20nS diode in hermetic package Applications / Markets: • Switch-mode power supply • Data communication and telecommunications system equipment • Hi-rel industry • Military • Aerospace Features / benefits: • Ultrafast Soft Recovery • Low Forward Voltage Drop • High Efficiency Switching • High Surge Capacity • Available In Lead.

  SSM200UF3A   SSM200UF3A






(SSMxxxUF3A) HERMETIC ULTRAFAST DIODE

www.DataSheet4U.com SENSITRON SEMICONDUCTOR TECHNICAL DATA DATASHEET 4241, Rev- SXX175UF3A SXX200UF3A SXX225UF3A SXX250UF3A HERMETIC ULTRAFAST DIODE Description: 3Amp, 20nS diode in hermetic package Applications / Markets: • Switch-mode power supply • Data communication and telecommunications system equipment • Hi-rel industry • Military • Aerospace Features / benefits: • Ultrafast Soft Recovery • Low Forward Voltage Drop • High Efficiency Switching • High Surge Capacity • Available In Leaded And Surface Mount Packaging • Upscreen to JANTX, JANTXV and JANS per Mil-Prf-19500 available • All Package Styles Are Hermetic, Non-Cavity • Metallurgical bond Maximum ratings TA=+25oC unless otherwise specified Types PIV Io Ir @ PIV µA V(pk) Amps Io1(1) Io2(2) 25 oC 100oC SXX175UF3A 175 6.0 3.0 5.0 150 SXX200UF3A 200 6.0 3.0 5.0 150 SXX225UF3A 225 6.0 3.0 5.0 150 SXX250UF3A 250 6.0 3.0 5.0 150 IFSM Tp=1/120 s A(pk) 125 125 125 125 Vf Trr (3) A 6.0 6.0 6.0 6.0 nS 20 20 20 20 RθJEC L=0 o ZθJX o TSTG, TJ o V 1.0 1.0 1.0 1.0 C/W 10 10 10 10 C/W 1.5 1.5 1.5 1.5 C -65 to 175 -65 to 175 -65 to 175 -65 to 175 XX = package style: AL: Axial Lead; SM: Surface Mount (1)TL=75 oC L=.375in. for axial lead package; TEC =TL at L=0 for surface mount package (2)TA=55 oC. This rating is typical for boards where thermal resistance from mounting point to ambient is sufficiently controlled where TJ(MAX) is not exceeded. (3)Reverse recovery time conditions: If=0.5A Ir=1.0A Irr=0.25A • 221 West.


2008-04-01 : A5970D    A5972D    A5973D    FBR4030    FBR4035    FBR4040    SSM200UF-A    SSM225UF-A    SSM250UF-A    FBR4045   


@ 2014 :: Datasheetspdf.com ::
Semiconductors datasheet search & download site (Privacy Policy & Contact)