‧Glass passivated chip ‧Low leakage ‧Built-in strain relief ‧Low inductance ‧High peak reverse power dissipation ‧Lead (Pb)-free component ‧For use in stabilizing and clipping circuits with high power rating ‧AEC-Q101 Qualified
Mechanical Data
‧Case...
SMB2EZ3.0D5 PDF File
