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SIGC16T120CS
IGBT Chip in NPT-technology
FEATURES: • 1200V NPT technology • 180µm chip • short circ...
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SIGC16T120CS
IGBT Chip in NPT-technology
FEATURES: 1200V NPT technology 180µm chip short circuit prove positive temperature coefficient easy paralleling
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This chip is used for: SGP07N120 Applications: drives, SMPS, resonant applications
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Chip Type
SIGC16T120CS
VCE 1200V
ICn 8A
Die Size 4.04 x 4 mm2
Package sawn on foil
Ordering Code Q67050-A4113
MECHANICAL PARAMETER: Raster size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max.possible chips per wafer Passivation frontside Emitter metalization Collector metalization Die bond Wire bond Reject Ink Dot Size Recommended Storage Environment 4.04 x 4 16.16 / 10.4 1.88x2.18 0.71x1.08 200 150 0 898 pcs Photoimide 3200 nm Al Si 1% 1400 nm Ni Ag –system suitable for epoxy and soft solder die bonding electrically conductive glue or solder Al, ≤500µm ∅ 0.65mm ; max 1.2mm store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C µm mm deg mm
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Edited by INFINEON Technologies AI PS DD HV3, L 7131-S, Edition 2, 03.09.2003
SIGC16T120CS
MAXIMUM RATINGS: Parameter Collector-emitter
voltage, Tj=25 °C DC collector current, limited by Tjmax Pulsed collector current, tp limited by Tjmax Gate emitter
voltage Operating junction and storage temperature
1)
Symbol V CE IC Icpuls V GE Tj, Ts t g
Value 1200
1)
Unit V A A V °C
24 ±20 -55 ... +150
depending on thermal properties of assembly
STATIC CHARACTERISTICS (tested on chip...