hybrid IC
Description
KA, SC
www.DataSheet4U.com
hybrid IC
EU
NEW features Adjustment processes are decreased by function and ratio trimmings High density mounting by bonding (COB) Various types of package are available High reliability achieved by KOA’s original thick film technology Thick film printed circuit substrate applies the non-noble metal paste (conductive p...
KOA Speer Electronics
SC7777D PDF File
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