Semiconductor
SB1314-V
Chip LED Lamp
Features
• • • • 1.6mm(L)×0.8mm small size surface mount type Thin package of 0.4...
Semiconductor
SB1314-V
Chip LED Lamp
Features
1.6mm(L)×0.8mm small size surface mount type Thin package of 0.4mm(H) thickness Transparent clear lens optic Low power consumption type chip LED
Applications
LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp
Outline Dimensions
unit :
mm
KLB-2001-001
1
SB1314-V
Absolute maximum ratings
Characteristic
Power Dissipation Forward Current * Peak Forward Current Reverse
Voltage Operating Temperature Storage Temperature
2 1
Symbol
PD IF IFP VR Topr Tstg
Ratings
80 20 50 4 -25∼80 -30∼100 240℃ for 5 seconds
Unit
mW mA mA V ℃ ℃
* Soldering Temperature Tsol *1.Duty ratio = 1/16, Pulse width = 0.1ms *2. Recommended soldering Temperature Profile
Temp(℃) Peak Temp max 240℃ 1~ 4℃/sec 220℃ 140~ 160℃ Preheating area 120 1~4℃/sec Time(sec)
Solder area max. 50sec
Peak time max 10sec
-2~ -6℃/sec
Electrical Characteristics
Characteristic
Forward
Voltage Luminous Intensity Peak Wavelength Spectrum Bandwidth Reverse Current Half Angle
Symbol
VF IV
Test Condition
IF= 20mA IF= 20mA IF= 20mA IF= 20mA VR=4V
Min
17 -
Typ
3.4 40 470 35 ±65 ±70
Max
4.0 68 10 -
Unit
V mcd nm nm uA deg
λP Δλ IR
θ1/2 X Y
IF= 20mA
KLB-2001-001
2
Characteristic Diagrams
SB1314-V
Fig. 1 IF - VF
Fig. 2 IV - IF
Forward Current IF [mA]
Forward
Voltage VF [V]
Luminous Intensity Iv [mcd]
Forward Current IF [mA]
Fig. 3 IF – Ta
Fig.4 Spectrum Distribution
Current IF [mA]
Forward
Relative Intensity [%]
...