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R5F51303AGFM Datasheet

Part Number R5F51303AGFM
Manufacturers Renesas
Logo Renesas
Description 32-bit RX MCUs
Datasheet R5F51303AGFM DatasheetR5F51303AGFM Datasheet (PDF)

Datasheet RX130 Group Renesas MCUs 32-MHz, 32-bit RX MCUs, 50 DMIPS, up to 128-KB flash memory, R01DS0273EJ0100 Rev.1.00 Oct 30, 2015 up to 36 pins capacitive touch sensing unit, up to 6 comms channels, 12-bit A/D, D/A, RTC, IEC60730 compliance, 1.8-V to 5.5-V single supply Features ■ 32-bit RX CPU core  Max. operating frequency: 32 MHz Capable of 50 DMIPS in operation at 32 MHz  Accumulator handles 64-bit results (for a single instruction) from 32-bit × 32-bit operations  Multiplication.

  R5F51303AGFM   R5F51303AGFM






Part Number R5F51303AGFM
Manufacturers Renesas
Logo Renesas
Description 32-bit MCU
Datasheet R5F51303AGFM DatasheetR5F51303AGFM Datasheet (PDF)

Datasheet RX130 Group Renesas MCUs 32-MHz, 32-bit RX MCUs, 50 DMIPS, up to 512-KB flash memory, R01DS0273EJ0300 Rev.3.00 Aug 09, 2018 up to 36 pins capacitive touch sensing unit, up to 6 comms channels, 12-bit A/D, D/A, RTC, IEC60730 compliance, 1.8-V to 5.5-V single supply Features ■ 32-bit RX CPU core • Max. operating frequency: 32 MHz Capable of 50 DMIPS in operation at 32 MHz • Accumulator handles 64-bit results (for a single instruction) from 32-bit × 32-bit operations • Multiplication.

  R5F51303AGFM   R5F51303AGFM







32-bit RX MCUs

Datasheet RX130 Group Renesas MCUs 32-MHz, 32-bit RX MCUs, 50 DMIPS, up to 128-KB flash memory, R01DS0273EJ0100 Rev.1.00 Oct 30, 2015 up to 36 pins capacitive touch sensing unit, up to 6 comms channels, 12-bit A/D, D/A, RTC, IEC60730 compliance, 1.8-V to 5.5-V single supply Features ■ 32-bit RX CPU core  Max. operating frequency: 32 MHz Capable of 50 DMIPS in operation at 32 MHz  Accumulator handles 64-bit results (for a single instruction) from 32-bit × 32-bit operations  Multiplication and division unit handles 32-bit × 32-bit operations (multiplication instructions take one CPU clock cycle)  Fast interrupt  CISC Harvard architecture with 5-stage pipeline  Variable-length instructions, ultra-compact code  On-chip debugging circuit ■ Low power design and architecture  Operation from a single 1.8-V to 5.5-V supply  Three low power consumption modes  Low power timer (LPT) that operates during the software standby state  Supply current High-speed operating mode: 96 A/MHz Supply current in software standby mode: 0.37 A  Recovery time from software standby mode: 4.8 s ■ On-chip flash memory for code, no wait states  Operation at 32 MHz, read cycle of 31.25 ns  No wait states for reading at full CPU speed  Programmable at 1.8 V  For instructions and operands ■ On-chip data flash memory  8 Kbytes (1,000,000 program/erase cycles (typ.))  BGO (Background Operation) ■ On-chip SRAM, no wait states  10- to 16-Kbyte size capacities ■ DTC  Four transfer modes .


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