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QIF4515002 Datasheet

Part Number QIF4515002
Manufacturers Powerex
Logo Powerex
Description Dual Common Collector HVIGBT Module
Datasheet QIF4515002 DatasheetQIF4515002 Datasheet (PDF)

Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com QIF4515002 Preliminary Dual Common Collector HVIGBT Module 150 Amperes/4500 Volts S NUTS (3TYP) A D FF J (2TYP) C 78 56 BE 1 23 H M H 4 G (3TYP) T (SCREWING DEPTH) R (DEEP) K (3TYP) L (2TYP) V (4TYP) U (5TYP) P Q N 61 5 4 2 8 73 Outline Drawing and Circuit Diagram Dimensions Inches Millimeters A 5.51 140.0 B 2.87 73.0 C 1.89 48.0 D 4.88±0.01 124.0±0.25 E 2.24±0.

  QIF4515002   QIF4515002






Dual Common Collector HVIGBT Module

Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com QIF4515002 Preliminary Dual Common Collector HVIGBT Module 150 Amperes/4500 Volts S NUTS (3TYP) A D FF J (2TYP) C 78 56 BE 1 23 H M H 4 G (3TYP) T (SCREWING DEPTH) R (DEEP) K (3TYP) L (2TYP) V (4TYP) U (5TYP) P Q N 61 5 4 2 8 73 Outline Drawing and Circuit Diagram Dimensions Inches Millimeters A 5.51 140.0 B 2.87 73.0 C 1.89 48.0 D 4.88±0.01 124.0±0.25 E 2.24±0.01 57.0±0.25 F 1.18 30.0 G 0.43 11.0 H 1.07 27.15 J 0.20 5.0 K 1.65 42.0 Dimensions Inches Millimeters L 0.69±0.01 17.5±0.25 M 0.38 9.75 N 0.20 5.0 P 0.22 5.5 Q 1.44 36.5 R 0.16 4.0 S M6 Metric M6 T 0.63 Min. 16.0 Min. U 0.11 x 0.02 2.8 x 0.5 V 0.28 Dia. 7.0 Dia. Description: Powerex HVIGBTs feature highly insulating housings that offer enhanced protection by means of greater creepage and strike clearance distance for many demanding applications like medium voltage drives and auxiliary traction applications. Features:  -40 to 150°C Extended  Temperature Range  100% Dynamic Tested  100% Partial Discharge Tested  Advanced Mitsubishi R-Series Chip Technology  Aluminum Nitride (AlN) Ceramic Substrate for Low Thermal Impedance  Complementary Line-up in Expanding Current Ranges to Mitsubishi HVIGBT Power Modules  Copper Baseplate  Creepage and Clearance Meet IEC 60.


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