PLASTIC INFRARED LIGHT EMITTING DIODE
QED422
PACKAGE DIMENSIONS
0.190 (4.83) 0.178 (4.52)
QED423
REFERENCE SURFACE
0....
PLASTIC INFRARED LIGHT EMITTING DIODE
QED422
PACKAGE DIMENSIONS
0.190 (4.83) 0.178 (4.52)
QED423
REFERENCE SURFACE
0.220 (5.59)
0.030 (0.76) NOM 0.800 (20.3) MIN
0.050 (1.27)
CATHODE 0.100 (2.54) NOM Ø 0.215 (5.46) NOM
SCHEMATIC
45°
0.020 (0.51) SQ. (2X)
ANODE
R 0.022 (0.56)
CATHODE NOTES: 1. Dimensions for all drawings are in inches (mm). 2. Tolerance of ± .010 (.25) on all non-nominal dimensions unless otherwise specified.
DESCRIPTION
The QED422/423 is an 880 nm AlGaAs LED encapsulated in a clear, purple tinted, plastic TO-46 package.
FEATURES
λ= 880 nm Chip material = AlGaAs Package type: Plastic TO-46 Matched Photosensor: QSD722/723/724 Medium Wide Emission Angle, 30° High Output Power Package material and color: clear, purple tinted, plastic
© 2002 Fairchild Semiconductor Corporation
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6/13/02
PLASTIC INFRARED LIGHT EMITTING DIODE
QED422
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise specified)
Parameter Operating Temperature Storage Temperature Soldering Temperature (Iron)(2,3,4) Symbol TOPR TSTG TSOL-I TSOL-F IF VR PD Rating -40 to + 100 -40 to + 100 240 for 5 sec 260 for 10 sec 100 5 200 Unit °C °C °C °C mA V mW
QED423
Soldering Temperature (Flow)(2,3) Continuous Forward Current Reverse
Voltage Power Dissipation(1)
NOTES: 1. Derate power dissipation linearly 2.67 mW/°C above 25°C. 2. RMA flux is recommended. 3. Methanol or isopropyl alcohols are recommended as cleaning agents. 4. Soldering iron 1/16" (1.6 mm) minimum from...