www.DataSheet4U.com
MITSUBISHI
PM75B4LA060
FLAT-BASE TYPE INSULATED PACKAGE
PM75B4LA060
FEATURE
a) Adopting new 5th generation IGBT (CSTBT TM ) chip, which performance is improved by 1µm fine rule process. For example, typical Vce(sat)=1.55V @Tj=125°C b) Over-temperature protection by detecting Tj of the CSTBT TM chips and error output is possible from all each conservation upper and lower arm of IPM. c) New small package Reduce the package size by 10%, thickness by 22% from S-DASH series. 2φ 75A, 600V Current-sense IGBT type inverter Monolithic gate drive & protection logic Detection, protection & status indication circuits for, shortcircuit, over-temperature & under-voltage (P-Fo available from upper arm devices) UL Recognized Yellow Card No.E80276(N) File No.E80271
APPLICATION Photo voltaic power conditioner
PACKAGE OUTLINES
L A B E L
11 7 19.75 (19.75) 3.25 16 3-2 16 3-2 120 106 16 3-2 15.25 6-2
Dimensions in mm
16 2-φ5.5 MOUNTING HOLES 3
12
17.5
1
5
9
13
19
14.5
B
U
V
W
32
6-M5 NUTS 10.75 12 32.75 23 23 23
11.75
13.5
55
2-φ2.5
17.5
N P
1 22 + – 0.5
(SCREWING DEPTH)
Terminal code
19-■0.5
1. 2. 3. 4. 5. 6. 7.
VUPC UFO UP VUP1 VVPC VFO VP
8. 9. 10. 11. 12. 13. 14.
VVP1 NC NC NC NC VNC VN1
15. 16. 17. 18. 19.
NC UN VN NC Fo
7
13 31
12
Oct. 2005
MITSUBISHI
PM75B4LA060
FLAT-BASE TYPE INSULATED PACKAGE
INTERNAL FUNCTIONS BLOCK DIAGRAM
NC FO 1.5k
VNC NC
VN1
VN
UN
NC N...
