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Thermal Data
PLCC 20
20 leads
PACKAGE MATERIAL LIST
item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W/cm°C
leadframe die attach
copper epoxy glue ( silver filler ) epoxy resin
0.25 mm 10-40 µm
molding compound
3.6 mm
0.0063W/cm°C
Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Rth(j-a) vs on board trace area 3) Zth(j-a) vs t...
