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Peripheral Imaging Corporation PI3039 600DPI CIS Image Sensor Chip Engineering Data Sheet
™
Descri...
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Peripheral Imaging Corporation PI3039 600DPI CIS Image Sensor Chip Engineering Data Sheet
™
Description:
Peripheral Imaging Corporation PI3039 CIS (Contact Image Sensor) sensor chip is a linear array image sensor chip with a 600 elements per inch resolution. The sensor chip is fabricated with PIC’s proprietary
CMOS Image Sensing Technology. Since this image sensor chip is intended for CIS module applications, multiple numbers of these sensors will be serially cascaded to form a linear scanning image array of arbitrary length. These sensors are butted end-to-end on a printed circuit board (PCB). The sensors are mounted using the chip-onboard technology to form scanning arrays with various lengths
8080 µm
1 2 3 4 189 190 191 192
ROW OF 192 SENSORS AND VIDEO SIGNAL LINE MULTIPLEXER
READ OUT SHIFT REGISTER
360 µm
BUFFER
BUFFER
CHIP SELECT
BUFFER
SP
CP
VDD
VSS
IOUT
EOS
Figure 1. PI3039 Sensor Block Diagram
Figure 1 is a block diagram of the sensor chip. Each sensor chip consists of 192 detector elements, their associated multiplexing switches, buffer
amplifiers, and a chip selector. The detector's elementto-element spacing is approximately 42µm. The size of each chip without the scribe lines is 8080 µm by 360 µm. Each sensor chip has 6 bonding pads. The pad symbols and functions are described in Table 1.
Page 1 of 10, PI3039, 12/2/02
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SYMBOL SP CP VDD VSS IOUT EOS
FUNCTION Start Pulse: Input to start the line scan. Clock ...